High thermal conductivity customerized 4W thermal conductive pad silicone heat transfer gap filler TIF100-40-06E
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High thermal conductivity 4W thermal conductive pad silicone heat transfer gap filler TIF100-40-06E Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Acid Proof Heat Resistance Cable Filler Yarn , Industrial Wire Split Yarn
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Acid Proof Heat Resistance Cable Filler Yarn , Industrial Wire Split Yarn Description: Polypropylene cable filler yarn made by virgin material of Polypropylene and CaCo3 granules ,it widely used in Cable industry for Cable and Wire filling use. It’s can ......
Jiangxi Longtai New Material Co., Ltd
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Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
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...Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light Bule Visual Density(g/cc) 3 ASTM D792 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥7.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity......
Shenzhen Aochuan Technology Co., Ltd
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Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
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...Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs Products Discription TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
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... gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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2 W / M * K Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate
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...Gap Filler Pads For Lithium Battery Pack Cooling Plate Discription of Thermal Gap Filler Pads: Thermal Gap Filler Pads is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and Thermal Gap Filler Pads effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. Thermal Gap...
Trumony Aluminum Limited
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Soft Thermal Sheet Thermally Conductive Pad Gap Filler For Led Lights
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... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not...
Adcol Electronics (Guangzhou) Co., Ltd.
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Dowsil TC-4525 Thermally Conductive Gap Filler 2.5W/m·K for Automotive
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... of 2.5 W/m·K, low compression stress, and controlled silicone volatility. Product Introduction This material cures to a soft and compressible elastomer designed to dissipate heat from components on printed circuit boards to heat sinks, providing a...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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... thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering......
SZ PUFENG PACKING MATERIAL LIMITED
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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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...Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance......
ZSUN CHIPS CO., LTD
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