94 V0 1.5W/MK Heat Sink Thermal Pad Sticky Insulation Blue CPU Laptop Cooling
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...e many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF100-05ES-Datasheet.pdf The TIF140-05ES is a...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Thermal Pad 94 V0 12 Shore 00 For Automotive Electronics
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...thermal pad, 94 V0, 12 Shore 00 for Automotive electronics The TIF1200-30-11ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Electrical Heat Sink Thermal Pad Silicone Rubber Heat Dissipation
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... Silicone Thermal Pad with Moldability and Double-sided Adhesive The Silicone Thermal Pad is a high-quality heat sink thermal pad made from high temperature silicone rubber material. It is designed to provide superior performance in heat dissipation and ......
Shenzhen Antac Technology Limited
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TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad
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...Thermal Gap Filler Pad Heat Sink Thermal Pad Product descriptions TlFTM200-08-04U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad
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Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ......
LiFong(HK) Industrial Co.,Limited
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Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) 20±5 ......
Shenzhen Aochuan Technology Co., Ltd
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Black High Heat graphite thermal pad 0.1mm thick 400 Centigrade
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Thermal Interface Material High Heat Conductivity Black Graphite These products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface ......
Boalv New Material Technology Co., Ltd.
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Customized High Quality Battery Vechical Electric High Thermal Conductivity Heat Conductive Silicone Pad
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...Thermal Pads Series Item No. Thermal Conductivity (W/m*K) Hardness (Shore 00) Density (g/cc) Voltage Resistance (KV/mm) Volume Resistivity (Ω*cm) Flame Rating (UL-94) 301-0150 1.5 5~80 1.8 10 10^12 V0 301-0200 2 5~80 2 10 10^12 V0 301-0300 3 15~80 3.0 8 10^12 V0 301-0400 4 15~80 3.3 8 10^12 V0 301-0600 6 20~80 3.5 8 10^12 V0 301-0800 8 30~80 3.6 8 10^12 V0 301-1000 10 30~80 3.3 6 10^12 V0 301-1200 12 30~80 3.210 6 10^12 V0...
Trumony Aluminum Limited
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Customized OEM Aluminum Die Casting Radiator Die Cast Heat Sink Versatile Thermal Conductivity
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Product Description: One of the key features of this heat sink is its customizable size. This allows you to tailor the heat sink to your specific needs and ensure that it fits perfectly in your application. Whether you need a small heat sink for a compact ......
Dongguan Guzhan Precision Metal Products Co.,Ltd
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0.2-20mm Soft Heatsink Thermal Pad , 6KV High Voltage Silicone Thermal Pad
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...Heat Sink Thermal Conductivity UL Certificated Thermal Silicone Pad LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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