Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
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...High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
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...High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
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...Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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