Double Sided Hdi High Density Interconnect Boards Copper Thickness 8oz
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Blind Hole Aspect Ratio 1 1 HDI Consumer Electronics With /- 0.06 Misalignment Of Layers Product Description: HDI PCB Board – High Density Interconnect for HDI Consumer Electronics HDI PCB Board is a revolutionary product that is designed to meet the ......
HONGKONG KINGTECH PCB SOLUTION LIMITED
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Waterproof EPE Foam Cushion Sheets High Density Polyethylene 0.5mm Thickness
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Customize Protective Cushion EPE Foam Cushion Sheets 0.5mm 1mm Thickness Polyethylene EPE Foam, EPE Foam Sheet 1. EPE foam insulation, a new earth friendly insulation, is easy to install, soft, non-toxic and tasteless. 2. The structure of EPE foam ......
SZ PUFENG PACKING MATERIAL LIMITED
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1.1 General description This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection......
Bicheng Electronics Technology Co., Ltd
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12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
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... line width high Tg High Density Interconnect HDI PCB: 12 layers FR-4 Tg 150 ENIG surface 1.6mm board thickness BGA with soldmask defined With inpedance control With Blind & buried via Copper Thickness: L1-------------------------------1/3OZ + Plating PP 3...
ShenZhen KaiZhuo Electronic Technology Co.,Ltd
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1.1 General description This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection......
Shenzhen Bicheng Electronics Technology Co., Ltd
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High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer
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... 2 Material FR4 tg170 3 Board thick 1.8mm 4 Usage Communication 5 Laser drill size 0.1mm 6 Min line trace 0.075mm 7 Min space 0.075mm 8 Surface treatment ENIG 3u'' 9 Copper thick 105um 10 Solder mask thick 10-30um 11 Buried via...
Abis Circuits Co., Ltd.
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High Density Interconnect PCB SMT Assembly Audio Circuit Board for Card Reader
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...high-frequency circuit board processing PCB circuit board Essential details Model Number: HDI PCB Type: motherboard pcba Place of Origin: Liaoning, China Brand Name: JIETENG Supplier Type: ODM/OEM Copper Thickness: 1 oz Product name: High Density Interconnect PCBs Feature: Technical specification Number of layers: 4- 22 layers standard, 30 layers advanced Materials: FR4 standard,FR4 high...
ShenZhen Jieteng Circuit Co., Ltd.
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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
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... 0.1MM 3 Buried holes: L4-L7 0.2MM. 4 Via holes: L1-L10 0.2MM. 5 PCB thickness is 1.0mm. 6 Min BGA ball size is 8mil. 7 Min line space and width is 3/3mil. 8 Material is FR4 Substrate, tg180 ......
Witgain Technology Limited
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High Density Interconnect PCB Board With Lamp Socket Support LED Screen HDI Prototype 4L 1+N+1 Quickturn
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... features make the board suitable for devices that require high-density interconnects with tight spaces, such as smartphones, tablets, and other handheld devices. The thickness of the board ranges from 0.4mm to 3.2mm, providing flexibility in the design process......
LT CIRCUIT CO.,LTD.
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Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 20 Layer Board
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...High Density Interconnect HDI PCB High TG Material 20 Layer Description 1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly 2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH......
Foisontech Corporation Co., Limited
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