Hdi High Density Interconnect Pcb Hdi 1+N+1 S1000-2m Pcb Material
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IPad third-order HDI PCB IPad third-order HDI board is one of a series of third-order HCI PCB boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. the board is made of Shengyi s1000-2m material, surface gold deposition and OSP. The ......
Quanhong FASTPCB
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HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated
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HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated Description 1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly 2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000......
Foisontech Corporation Co., Limited
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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
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..., L8-L9 0.1MM 3 Buried holes: L4-L7 0.2MM. 4 Via holes: L1-L10 0.2MM. 5 PCB thickness is 1.0mm. 6 Min BGA ball size is 8mil. 7 Min line space and width is 3/3mil. 8 Material is FR4 Substrate, tg180 degree 9 S1000-2 material used. S1000-2...
Witgain Technology Limited
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