Elevate Your Optoelectronics With High Thermal Conductivity MgO Single Crystal Substrate
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... Crystal Substrates. As a leading innovator, we offer MgO Single Crystal Substrates distinguished by their exceptional crystallinity, purity, and superior material properties. Our MgO Substrates boast high thermal conductivity, low dielectric constant, and...
Hangzhou Freqcontrol Electronic Technology Ltd.
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High Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic Substrate
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...Substrate, High Thermal Conductivity 0.5mm AlN Ceramic,6inch ceramic substrates AlN Introduce The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal......
SHANGHAI FAMOUS TRADE CO.,LTD
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High Thermal Conductivity Aluminum Substrate LED Stadium Light with Triac/0-10V Dimmable and Waterproof IP65-67
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...High Thermal Conductivity Aluminum Substrate LED Stadium Light: Strong bracket, more solid installation Optical PC lens, no-yellowing material Silicone waterproof sealing strip. UV-resistant material, reliable without failure 3030 SMD light source design, luminous efficiency 150lm/W High thermal conductivity aluminum substrate......
Shenzhen Benwei Lighting Technology Co., Ltd.
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12 layers Thickness: 2.0mm Size: 1200*36mm conductivity 8WPP + 8W high thermal conductivity Metal Substrate PCB pcb boar
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...: 12 layers Thickness: 2.0mm Size: 1200*36mm/1PCS Process structure: mirror aluminum + 2L aluminum base, thermal conductivity 8WPP + 8W high thermal conductivity aluminum aluminum, Copper thickness 210um Surface treatment:...
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Sandblast Laser Scribing Zirconia Alumina Ceramics Substrate High Thermal Conductivity
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...Substrate High Thermal Conductivity Ceramic Substrate: The ceramic substrate, is a sheet-like material which forms a supporting base for the film circuit component and the externally-applied component on the basis of the electronic ceramic.Ceramic substrates have high temperature resistance, high electrical insulation properties, low dielectric constant and dielectric loss, high thermal...
Wuxi Special Ceramic Electrical Co.,Ltd
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1.2W / mK HIGH Thermal conductive Pad TIF100-12-58UF GREEN Non Toxic 85 Shore 00
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...2W / mK HIGH Thermal conductive Pad TIF100-12-58UF GREEN Non Toxic 85 Shore 00 The TIF100-12-58UF Series The heat conduction interface material is used to fill the air gap between the heating element and the heat sink or metal substrate. Their flexibility......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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High Thermal Conductivity Alumina Ceramic Plate , Thin Alumina Ceramic Substrate
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... it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications (sputtering). Description of Alumina Ceramic substrates : Alumina Ceramic substrates can...
Dongguan Ming Rui Ceramic Technology Co.,ltd
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High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness
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... manufactured from high-purity alumina (Al₂O₃ content 96%-99.9%), featuring excellent insulation properties, high thermal conductivity and low dielectric loss. With precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates are...
Dayoo Advanced Ceramic Co.,Ltd
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Aluminum Nitride AIN Ceramic Substrate Parts High Thermal Conductivity
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High Thermal Conductivity Aluminum Nitride AlN Ceramic Substrate Specification of ceramic metallised substrate: 1. Available material: Alumina(Al2O3), Aluminum nitride (AlN) and Beryllia (BeO) 2. Size capability: min. size to be 1mm x 1mm, max. size to be ......
Jinghui Industry Limited
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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
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...high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal conductivity, low thermal resistance. High adherence, soft and elastic, easy to install, can be repeatedly disassembled. Used in electronic appliances, automotive machinery and other body as heat dissipation, insulation components, notebook computers, computer hosts, power devices, high......
SZ PUFENG PACKING MATERIAL LIMITED
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