Stable Transmission IC Test Sockets Semiconductors Industry Testing Socket
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IC Test Socket Leading Semiconductor Brand — Yiding Technologies In the fast-evolving semiconductor industry, Yiding Technologies stands at the forefront with precision engineering and innovative solutions, delivering high-frequency test sockets and comprehensive semiconductor application services. Our Services Semiconductor Manufacturing & Processing Test Fixtures & Spring Probes Vertical Probe Cards High-Frequency Test Socket Automated Test...
Dongguan Yiding Technologies Co., Ltd.
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BGA152 BGA132 to DIP48 Adapter IC Test Socket BGA88 BGA136 Burn in Socket Programmer Socket clamshell Structure Test Sea
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...Pin Count : 152/132 d) Applicable IC body width : 12*18/14*18 Characteristics are as below: 1. This product is for BGA152 adapter to dip48 solution, apply to BGA 152 adapter read and test. 2. Apply to Samsung, Sandisk, Hynix, Toshiba, Intel, etc. 3. It is...
Shenzhen hongyi electronics Co.,LTD
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2.54mm IC Test Socket / Zif Type Connector With Center Distance 7.62 / 15.24mm
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... force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is...
Ningbo Anyo Import & Export Co., Ltd.
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OTQ44-0.8-14,QFP44 Programmer ,IC test socket, flash
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... work temperature : -60~155 degree ITEM : QFP-44-0.8 PIN distance : 0.8mm , 44 pin IC size : 10*10mm/12*12mm we have too many kinds of test socket didn't show here . we can also do OEM socket for the customers . please welcome to contact with us for detail...
HUANGU Electronic Tech co.,ltd
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Industrial PCT Aging Test Chamber with SUS316 Stainless Steel 100% Saturated Steam Humidity and 7-inch Color Touch Screen
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Industrial PCT Aging Test Chamber Pressure Cooker Environmental Test Chamber for Electronic Product Reliability Test UP-6125 Product Overview Our PCT Test Chamber (Pressure Cooker Test Chamber / HAST Chamber) is designed for high pressure high temperature saturated steam accelerated aging reliability testing. It complies with IEC60068-2-66, JESD22-A102 and JESD22-A118 standards. Widely used for semiconductor IC......
Dongguan Youbi Test Equipment Co.,Ltd
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PH1.27 PGA Female Socket CPU Test Socket board connector PGA test socket Machined Contact
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...Socket CPU Test Socket board connector PGA test socket Machined Contact What is the PGA socket? PGA (Pin Grid Array) sockets are a type of IC (Integrated Circuit) socket used for devices with a high number of pins arranged in a grid pattern. These sockets allow for reliable electrical connections and easy insertion/removal of PGA-packaged chips. Common pitch sizes include 1.27mm to 2.54mm, and they are widely used in CPU testing...
SHENZHEN JRKCONN ELECTRONICS CO.,LTD
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Anti Static PET Blister Tray for IC Chip Semiconductor Packaging Custom Thermoformed ESD Tray
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Product descriptions from the supplier Customizable Thickness: Tailored to fit various agricultural needs. Anti-Static Properties: Protects contents from static electricity damage. PET Material: Durable and lightweight for efficient handling. Custom Made ......
Wuhan Tianhua Technology Development Co., Ltd.
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Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire
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Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire Adaptable to different bonding machine parameters, high stitch pull strength for BGA semiconductor test socket packaging. Company Information...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
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...Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment This fully automatic molding system is the perfect solution for all your semiconductor......
Guangdong Taijin Semiconductor Technology Co., Ltd
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QFN test sockets including 3M 264-4205-00 designed for 0.4 mm and 0.5 mm pitch package testing
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...Sockets for QFN Applications are designed for testing and burn-in of Quad Flat No-lead (QFN) packages. This product family includes sockets for 0.4 mm and 0.5 mm pitch QFN devices, utilizing a common contact for both pitch offerings. These sockets are engineered for reliable performance in demanding test environments, as demonstrated by evaluation reports focusing on actuation force, contact force, IC...
Shenzhen ECER Network Technology Co., Ltd.
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