4" LT Wafer 36°, 39°, 42 ° X-CUT Used For Surface Acoustic Wave Devices
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...LT Wafer 36°, 39°, 42 °, 46°, 48°, X-CUT used for Surface Acoustic Wave Devices Lithium tantalate (LiTaO3), has properties which make it useful for SAW (surface acoustic wave) devices and, to a different specification, for optical use. Wafers can be produced with varying properties, such as "black" wafers free of pyroelectric discharge, 4" (100mm), orientation 36°, 39°, 42 °, 46°, 48°, X-CUT......
Hangzhou Freqcontrol Electronic Technology Ltd.
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Polarized LT Wafer Litao3 Substrate Application For SAW Devices
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...LT Wafer Litao3 Substrate Application For SAW Devices Lithium Tantalate (LT, LiTaO3) has unique properties, which as a material finds uses in Electro-Optical and Acousto-Optical applications. These can be : surface acoustic wave devices, bulk acoustic wave devices, piezo-electric transducers and piezoelectric sensors.The 36° and 42 ° cuts......
ANHUI CRYSTRO CRYSTAL MATERIALS Co., Ltd.
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Undoped InSb Wafer , 2”, As - Cut Wafer , Mechanical Wafer , Or Polished Wafer
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...Wafer, 2”, As-Cut Wafer, Mechanical Wafer, Or Polished Wafer PAM-XIAMEN provides single crystal InSb(Indium Antimonide) wafer growth by Liquid Encapsulated Czochralski ( LEC ) method. Indium Antimonide (InSb) can be supplied as wafers with as-cut, etched or polished finishes and are available in a wide range of carrier concentration, diameter and thickness.PAM-XIAMEN can provide epi ready grade InSb wafer......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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Industrial Tooth Tungsten Carbide Shear Blade for Silicon Wafer Metal Cutting
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...Wafer Metal Cutting We proudly introduce the high-precision tungsten carbide shear blade designed for the metal sheet cutting, specifically tailored for cutting silicon wafer metals. Manufactured and customized by Zhuzhou Sanxin Tungsten carbide, these blades are produced using advanced processing techniques to meet the high demands of precision cutting. Key Features: Versatile Cutting...
Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd
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Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation
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Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation ※Product Introduction Solar technologies use the sun's energy to provide heat, light, hot water, electricity, and even cooling, for homes, businesses, and industry. Despite ......
Perfect Laser (Wuhan) Co.,Ltd.
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5W 7W 10W 18W 35W 532nm Green Laser Fiber Marking Machine Crystal Glass Wafer Engraving Cutting
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5W 7W 10W 18W 35W 532nm Crystal Glass Wafer Engraving Cutting Green Laser Marking Machine Basic introduction The green laser marking machine is developed using the most advanced laser pumping technology with a wavelength of 532nm in the world, and the ......
Shenzhen Dapeng Laser Equipment Co., Ltd.
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Cast Ductile Iron SS Lt Wafer Type Butterfly Valve with EPDM PTFE Sealing Ring Customized
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Mingyi Machinery (Tianjin) Co., Ltd
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Customized Steel Slicing Si Wafer Stone Cutting Marble Quarry Wire Saw
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Product Description Product Parameter Company Information Workshop Certificate Exhibition FAQ 1: Are you trading company or manufacturer? We have been the world's leading manufacturer of superabrasives, superhard composites and superhard cutting tools. 2: ......
Henan Huanghe Whirlwind International Co.,Ltd.
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LiTaO3 LiNbO3 Wafers LN LT Thin Films Wafers 42°Y
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...substrate material is a piezoelectric crystal such quartz (SiO2), lithium tantalate (LiTaO3) or lithium niobate (LiNbO3). This are single crystal materials, which are cut out after the growth process with a defined orientation to a wafer. NQW produced this...
SHANGHAI FAMOUS TRADE CO.,LTD
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Heat Resistant Plastic Wafer Hoop Ring For Expand Wafer
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...wafer COB packaging process. The first step is to expand the wafer. The whole wafer film provided by the manufacturer is evenly expanded by using an expander, so that the wafer particles closely arranged on the surface of the film can be opened, which is...
Shenzhen Hiner Technology Co., Ltd.
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