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Max 0 2mm Waffle Pack Chip Trays

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max 0 2mm waffle pack chip trays

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SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

SGS Chip Tray Waffle Pack For Optical Device Packaging 0.2mm Flatness A semiconductor packing material is a material whose ability to conduct electricity is intermediate between a conductor and an insulator. It is a kind of electronic material with ......

Shenzhen Hiner Technology Co., Ltd.

Address: Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

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To: Shenzhen Hiner Technology Co., Ltd.
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Your subject must be between 10-255 characters!
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For the best results, we recommend including the following details: --Self introduction --Required specifications --Inquire about price/MOQ Your message must be between 20-3,000
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