Multiscene Laptop CPU Thermal Pad
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Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc......
Shenzhen Aochuan Technology Co., Ltd
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High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
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...Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads
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TIF®100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads The TIF®100-12-05US Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
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Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......
Shenzhen Antac Technology Limited
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Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
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Shenzhen Senwi Printing & Packaging Co., Ltd.
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Odm Metal Stamping Parts Laptop Gpu Cpu Vga Chip Ram Heatsink Sheet 1.2kg Thermal Pad
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ......
Nanpi Xinchengweiye Hardware Products Co., Ltd.
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad
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Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ......
LiFong(HK) Industrial Co.,Limited
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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