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Nova Plus Flip Chip Die Bonder

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nova plus flip chip die bonder

from 4 Products

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

China ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used on sale
...NOVA Plus Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder......
INFINITE AUTOMATION CO ., LIMITED

Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China

Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

China Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine on sale
... for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and...
Shenzhen Hongxinteng Technology Co., Ltd.

Address: Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

China High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders on sale
...PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China

Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment

China Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment on sale
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features......
Unicomp Technology

Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
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