InAs Indium Arsenide2inch 3inch 4inch Single Crystal Substrate N/P Type Semiconductor Wafer Thickness 300-800um
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... InAs Indium Arsenide2inch 3inch 4inch Single Crystal Substrate N/P Type Semiconductor Wafer Thickness 300-800um Indium InAs or indium arsenide monolithic is a semiconductor composed of indium and arsenic. It has a gray cubic crystal appearance and ......
SHANGHAI FAMOUS TRADE CO.,LTD
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2inch 4inch 6inch 8inch 12inch Si Wafer Silicon Wafer Polishing Undoped P Type N Type Semiconductor
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... can be found in all types of electronic devices that improve the lives of people. Silicon comes second as the most common element in the universe; it is mostly used as a semiconductor in the technology and electronic sector. Most people have had the...
SHANGHAI FAMOUS TRADE CO.,LTD
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P Type , GaSb(Gallium Antimonide) Wafer , 2”, Test Grade -Semiconductor Wafer Manufacturing
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...Type , GaSb(Gallium Antimonide) Wafer , 2”, Test Grade -Semiconductor Wafer Manufacturing PAM-XIAMEN offers GaSb wafer – Gallium Antimonide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or undoped in different orientation(111)or(100).Gallium antimonide (GaSb) is a crystalline compound made from the elements Gallium (Ga) and antimony (Sb). 2" GaSb Wafer......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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Soi Wafer Silicon on Insulator Semiconductor Wafer
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...Wafer Silicon on Insulator Semiconductor Wafer SOI Wafer (Silicon On Insulator) * SOI Wafer sizes from 3" to 200mm, some in inventory * Very high quality with tight TTV on device layer thickness * Direct Si-Si bonding and double sided SOI available * Any Si orientation, any device thickness over 1.5um * Single and double side polished * Small lot sizes and Laser marking of wafers available * Short lead time delivery TYPES OF SOI WAFER...
Shenzhen A.N.G Technology Co., Ltd
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12 Inch 5nm Semiconductor Wafer Chip Wafer Scrap Laser Chip
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This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products. Market uses are as follows: 5nm wafer 5NANO technology wafer ......
Shenzhen Chuangying Times Technology Co., Ltd.
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6 Inch 5 Solts Semiconductor Wafer Carrier For Inspection And Transportation In Wafer Fabrication
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...le sheet of wafer film uniform expansion, so that attached to the surface of the film tightly arranged grains pull apart, in order to facilitate solid crystal. At this ......
Shenzhen Hiner Technology Co., Ltd.
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Semiconductor Wafers Ultrasonic Cleaning System 100KW Automated Ultrasonic Cleaner
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...Cleaning System For Semiconductor Wafers Intelligent Cleaning: The equipment adopts a fully automatic feeding and discharging cleaning mode to clean the silicon wafers. Meanwhile, the equipment is compatible with cleaning silicon wafers of various sizes......
guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
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Semiconductor Wafer Saw Blade Thickness 0.015 mm-0.3 mm Gallium Phosphide
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... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Precision CNC Components Wafer Rail 7075 Aluminum Alloy Semiconductor Wafer Transfer Guides
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...Semiconductor Wafer Transfer Guides 7075 aluminium alloy is ideally suited for the manufacture of semiconductor wafer transfer guides due to its high strength, good corrosion resistance, low density and excellent machinability. Its performance can be further enhanced by appropriate heat treatment and surface treatment to meet the stringent requirements for precision and reliability in semiconductor......
JimaFor
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Ultrasonic Semiconductor Wafer Coating Continuous
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...Semiconductor Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer...
Hangzhou Qianrong Automation Equipment Co.,Ltd
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