Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad
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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad The TIF™500US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
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High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-40-05U High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
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TIF100-40-05U High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Ziitek TIF®100-40-05U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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0112 Silicone Thermal Grease 1.6W/M·K Eco-Friendly Odorless Gap Filler For CPU Or LED Chip Thermal Conductivity
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0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: paste; Wide working temperature range; Nontoxic......
Shanghai Huitian New Material Co., Ltd
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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... Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in ......
Adcol Electronics (Guangzhou) Co., Ltd.
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical
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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Visual Density(g/cc) 1.8 ASTM D792 ......
Shenzhen Aochuan Technology Co., Ltd
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High Performance One Component Thermal Gap Filler for PCB CPU
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... with thermally conductive filler, stirred, mixed and encapsulated. It adopts dispensing design, when used with the glue mixing nozzle hit, easy to use and fast, can achieve ......
Trumony Aluminum Limited
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Dowsil TC-4525 Thermally Conductive Gap Filler 2.5W/m·K for Automotive
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... of 2.5 W/m·K, low compression stress, and controlled silicone volatility. Product Introduction This material cures to a soft and compressible elastomer designed to dissipate heat from components on printed circuit boards to ......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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...Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits Silicone......
ZSUN CHIPS CO., LTD
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