Thermal Interface Material Pads Thermal Silicone Pad for New Energy Vehicle Batteries PCB
|
... pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. TIF700PUS-data sheet.pdf Features > Good thermal conductive: 7.5 W/mK > Thickness: 1.0 mmT >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
|
Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits Silicone......
ZSUN CHIPS CO., LTD
|
Electrically Isolating Silicone Thermal Interface Materials For LED Street Lamp
|
Electrically Isolating Silicone Thermal Interface Materials For LED Street Lamp Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA ......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad
|
0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
|
Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler
|
..., thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
|
5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
|
180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
|
...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
|
Electronics CPU Silicone Thermal Pad Industry Thermal Interface Pad
|
...Silicone Thermal Pad For Medical Equipment Field The Silicone Thermal Pad is a high quality and durable thermal interface material, specially designed for electronic components such as CPUs, GPUs, and other heat generating devices. It is made of high temperature silicone rubber, providing excellent thermal conductivity and insulation for efficient heat dissipation. Product Overview The Silicone Thermal...
Shenzhen Antac Technology Limited
|
BERGQUIST GAP PAD TGP HC5000S Heat Conduction Insulation Silicone Thermal Pad
|
...PAD TGP HC5000S heat conduction insulation silicone pad Product features/Applications: Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress；Fiberglass reinforced for shear and tear resistance. Used in telecommunications, Integrated circuits ,digital signal processing systems, consumer electronics, hot modules to radiators,Thermal management , TIM (Thermal Interface Material......
SZ PUFENG PACKING MATERIAL LIMITED
|
Submit your “silicone thermal interface material pad” inquiry in a minute :