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Thermal Gap Pad For Telecommunication Hardware

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thermal gap pad for telecommunication hardware

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3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

China 3.0w/Mk Thermal Gap Pad For Telecommunication Hardware on sale
...Thermal Performance Thermal Pad for Telecommunication Hardware The TIF120-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. TIF100-30-02US-Datasheet-REV02.pdf Features > Good thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City

4.0W/MK 20 Shore 00 3.0mmT Ultra Soft Thermal Gap Pad For Telecom Hardware

China 4.0W/MK 20 Shore 00 3.0mmT Ultra Soft Thermal Gap Pad For Telecom Hardware on sale
4.0W/MK 20 Shore 00 Telecommunication hardware applied 3.0mmT ultra soft thermal gap pad TIF5120-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the ......
Dongguan Ziitek Electronical Material and Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China

TIF500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware

China TIF500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware on sale
..., to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu district, Thai Binh Province, Vietnam

BERGQUIST GAP PAD TGP HC5000S Heat Conduction Insulation Silicone Thermal Pad

China BERGQUIST GAP PAD TGP HC5000S Heat Conduction Insulation Silicone Thermal Pad on sale
...GAP PAD TGP HC5000S heat conduction insulation silicone pad Product features/Applications: Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress；Fiberglass reinforced for shear and tear resistance. Used in telecommunications, Integrated circuits ,digital signal processing systems, consumer electronics, hot modules to radiators,Thermal management , TIM (Thermal......
SZ PUFENG PACKING MATERIAL LIMITED

Address: B/B,Shayi Dongjiang Huanbao Industrial City,Shajing Street,Shenzhen City,China
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