TO8 Header Encapsulated Components Transistor Outline Package
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Product name: Sealed enclosure alloy package for circuit Finish: Fully plating Au or selective plating Au. Plating coating: Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um. Product formation: Material Quantity 1. Cap 10#......
JOPTEC LASER CO., LTD
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TO8 Encapsulation Technology Silicon Pressure Sensor for Aerospace Applications
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TO8 Encapsulation Technology Silicon Pressure Sensor for Aerospace Applications HT12 Silicon Piezoresistive Pressure Sensor Introduction of silicon pressure sensor: The HT12 silicon piezoresistive pressure sensor is a highly stable diffusion silicon element packaged using advanced TO8 packaging......
Baoji Hengtong Electronics Co., LTD
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D882S NPN Tip Power Transistors TO-92 Plastic Encapsulated Transistors
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...92 Plastic-Encapsulate Transistors D882S TRANSISTOR (NPN) FEATURE Power dissipation MARKING D882=Device code Solid dot=Green molding compound device, if none,the normal device Z=Rank of hFE, XXX=Code ORDERING INFORMATION Part Number Package Packing Method ......
Shenzhen Hua Xuan Yang Electronics Co.,Ltd
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2SB649A Silicon PNP Transistors Power Transistors ic Plastic Encapsulate Transistors Plug-in board IC Electronic Component
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Product Description Packaging Tube/Bulk Part Status Active Type PNP Operating Temperature -55°C ~ 175°C (TJ) Mounting Type Through Hole Supplier Device Package TO-126 Yonlanda Skype: qyt-yolanda1 Email: yonlandasong(at)quanyuantong.net...
Shenzhen Quanyuantong Electronics Co., Ltd.
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200v Silicon Power Transistor High Current Transistor Low Leakage
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...℃ unless otherwise specified) Typical Characterisitics Package Outline Dimensions Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.900 1.150 0.035 0.045 A1 0.......
Beijing Silk Road Enterprise Management Services Co.,LTD
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EL3H4 Integrated Circuit IC Chip Optoisolator Transistor Output 3750Vrms 1 Channel 4 SSOP
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...Transistor Output 3750Vrms 1 Channel 4-SSOP Description The EL3H4-G series contains two infrared emitting diode, connected in inverse parallel, optically coupled to a phototransistor encapsulated with green compound. It is packaged in a 4-pin small outline SMD package......
Shenzhen Koben Electronics Co., Ltd.
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PS2811-1-F3-A Transistor Output Optocouplers 2500 Vrms Opto Electronics
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... in a plastic SSOP for high density applications. The package is a Shrink SOP (Small Outline Package) type for high density mounting applications. FEATURES High current transfer ratio (CTR = 200% TYP. @ IF = 1 mA) High ......
Walton Electronics Co., Ltd.
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CJ2310 S10 Plastic Encapsulate Dual Gate Mosfet , High Power N Channel Mosfet
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...Transistors N-Channel MOSFET Plastic-Encapsulate MOSFETS DESCRIPTION The CJ2310 uses advanced trench technology to provide excellent RDS(ON) , low gate charge and operation with gate voltage as low as 2.5V. This device is suitable for use as a battery protection or in other switching application. FEATURE High power and current handing capability Lead free product is acquired Surface mount package......
DELI ELECTRONICS TECHNOLOGY CO.,LTD
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XC7A100T-2FGG484I Encapsulation BGA484 Embedded Chip SMD
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XC7A100T-2FGG484I Encapsulation BGA484 Embedded Chip Product Specifications ITEM VALUE D/C NEW Condition Original Package Original Type ICS Brand Original Brand Applications Network Communications Series MCU Description In Stock Warranty 30~90 Days Lead ......
Shenzhen Tengshengda ELECTRIC CO., LTD.
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Silicon Power npn general purpose transistor 2N6038 TO -126 package
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...purpose transistor 2N6038 TO -126 package DESCRIPTION ·With TO-126 package ·Complement to type 2N6034/6035/6036 ·DARLINGTON ·High DC current gain APPLICATIONS ·Designed for general-purpose amplifier and low-speed switching applications PACKAGE OUTLINE...
Anterwell Technology Ltd.
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