Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
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...Thermal Pad For Between Transistors And Heat Sinks Company profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIR300L Graphite Composite Thermal Pad For Between Transistors And Heat Sinks
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...Thermal Pad For Between Transistors And Heat Sinks TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
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...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal......
Shenzhen Antac Technology Limited
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2 W/m.K Thin Silicone Free Thermal Pad Multipurpose For Hard Disk
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...Thermal Conductivity Blue Silicone Free Thermal Pad For Hard Disk Attribute Value Test Method Composition Acrylate - Color Blue Visual Thickness(mm) 0.5-10.0 ASTM D374 Density(g/cc) 2.9 ASTM D792 Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Application of silicon free thermal pad......
Shenzhen Aochuan Technology Co., Ltd
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5mm LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU
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...a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. TIF700HP-Series-Datasheet.pdf Features > Good thermal conductive: 7.5 W/mK >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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0.2-20mm Soft Heatsink Thermal Pad , 6KV High Voltage Silicone Thermal Pad
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...Thermal Conductivity UL Certificated Thermal Silicone Pad LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Pads Thermal Conductive Pad For New Energy Vehicle Batteries
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... can effectively exclude air and achieve good filling and thermal conductivity effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. thermal conductive silicone pads are...
Trumony Aluminum Limited
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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Ceramic Insulation Thermal Pads 4mm Alumina Oxide Ceramic Plate
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...Thermal Pads Alumina Oxide Ceramic Plate Alumina oxide ceramic plate has a high thermal conductivity : 24w/m.k, 0.635mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm can be offered for TO-220, TO-247, TO-264, TO-3P sizes, customized size is available, ROHS is compliant. IC, MOS, transistor......
Dongguan Ming Rui Ceramic Technology Co.,ltd
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Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
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... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with...
ZSUN CHIPS CO., LTD
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