Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade
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Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and ......
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
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...-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Customized Metal 6 8 12 Inch Semi Wafer Dicing Frame Ring Metal Ring Wafer Frame
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... processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use. Semi-Wafer Cutting Frame Ring (1)This wafer dicing frame is...
Shenzhen Hiner Technology Co., Ltd.
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Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade
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0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility......
Shaanxi Tongyu Industry And Trade Co,.Ltd
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3 Inch and 4 Inch Single Crystal Quartz Wafer for SAW and MEMS Devices Production Process
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...precision and durability, our single-crystal quartz wafers are the ideal solution. These wafers, crafted from pure quartz, exhibit exceptional piezoelectric properties, converting mechanical energy into electrical signals with unparalleled accuracy. Our...
Hangzhou Freqcontrol Electronic Technology Ltd.
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Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade
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Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade Product overview Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow ......
China Abrasives Industry Hainan Corporation
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4inch Black Lithium Tantalate Wafer For SAW Use
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... with excellent piezoelectric, ferro-electric, acoustic-optical and electro-opticaleffects.Therefore, it has become a basic functional material in the field of acoustic surface wave (SAW) devices, optical communication, laser, and opto-electronics....
ANHUI CRYSTRO CRYSTAL MATERIALS Co., Ltd.
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Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging
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... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of...
Shenzhen KHJ Technology Co., Ltd
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Sand Casting QT200 Ductile Cast Iron Dicing Saw Base Seat For Saw Machinery
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Factory Price QT200 Ductile Iron Casting Dicing Saw Base Seat Product Details Material Cast Iron and Cast Steel , ductile iron,Aluminum Producing Process Sand casting, ......
Sunrise Foundry CO.,LTD
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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting
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Automated Precision Dicing Machine High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics......
SHANGHAI FAMOUS TRADE CO.,LTD
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