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XCZU19EG-3FFVD1760E
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XCZU19EG-3FFVD1760E
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Beijing Silk Road Enterprise Management Services Co.,LTD
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FPGA IC Chip XCZU19EG-1FFVB1517E Field Programmable Gate Array FBGA1517
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...IC Chip XCZU19EG-1FFVB1517E Field Programmable Gate Array FBGA1517 Product Description Of XCZU19EG-1FFVB1517E XCZU19EG-1FFVB1517E Quad-core application processor-equipped (EG) devices excel in wired and wireless infrastructure, data center, and Aerospace and Defense applications. Specification Of XCZU19EG-1FFVB1517E Part Number: XCZU19EG......
ShenZhen Mingjiada Electronics Co.,Ltd.
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XCZU19EG-3FFVD1760E Xilinx
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Product Attribute Attribute Value Select Attribute Manufacturer: Xilinx Product Category: SoC FPGA Shipping Restrictions: This product may require additional documentation to export from the United States. RoHS: Details Mounting Style: SMD/SMT Package / ......
ZhongHao Industry Limited
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XCZU19EG-2FFVD1760I IC FPGA 308 I/O 1760FCBGA Integrated Circuits ICs
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HENKOSINO TECHNOLOGY CO.,LTD
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TL082CP Integrated Circuit IC Chip Operational Amplifier High Performance Reliability IC Chip
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TL082CP Integrated Circuit IC Chip Operational Amplifier High Performance Reliability IC Chip Product Listing: Product: TL082CP Integrated Circuit IC Chip Description: The TL082CP is an integrated circuit IC chip that features two independent, high-gain, ......
Shenzhen Sai Collie Technology Co., Ltd.
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Experience the Power of Electronic Components IC Chips for Your Business
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...comes to Computer IC Chips, Amplifier IC Chips, and IC Circuit Board components, the IC Chips product offers a comprehensive solution for various electronic applications. These high-quality chips are designed to enhance the performance and efficiency of...
ZSUN CHIPS CO., LTD
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2 Inch Square Portable Black Plastic IC Chip Tray For IC Devices
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...IC Chip Tray For IC Devices ESD Black Plastic Storage Chip Tray For For Carrying IC With Different Size Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip......
Shenzhen Hiner Technology Co., Ltd.
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