0 8mm ic package substrate

Brand Name:Horexs

Place of Origin:china

.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Place of Origin:Guangdong, China

Brand Name:PG

Model Number:G25064GTLCA

eMMC IC FLASH 64GBIT EMMC 153FBGA FLASH NAND Memory IC 128GB 64Gb 32GB 16GB 8G X 8 eMMC5.1 153 WFBGA 11.5x13x0.8 WHY CHOOSE US? 1.Strong research and development strength 2. Our factory has advanced packaging and testing technology 3. Complete storage ...

Brand Name:Delicacy

Model Number:TINPLATE

Place of Origin:CHINA

...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging...

Brand Name:allesd

Model Number:AT-0112

Place of Origin:China

... PET Tape Material: PET Size: 8mm*36m or Customized Sizes Color: Silver Gray Translucent Thickness: 0.14-0.15mm Adhesive: Single Sided Feature: ANTISTATIC Industrial use: Electronic,ESD shielding packaging raw material,IC PCB board,Factory Printing: No

Brand Name:Learnew

Model Number:LN-SMD3838UVB-P3

Place of Origin:Shenzhen，China

...8mm UVB 80-120mW 3838 SMD UVB LED Chip for Photometer and Photosensitive Power 3W IF 350mA(Max=700mA) VF 4-5V Whole Size 3.8*3.8mm Dominant Wavelength 340-350nm View Angle 120° Lens Quartz Glass Lens Substrate ALN Coppering Chips Flip Chip(LG & Dowa) Warranty 10,000Hrs or 2 years Optical Power 80-120mW SMD UVB LED Chip Design Advantage: 1, Quartz glass package...

Brand Name:Texas Instruments

Model Number:TPS55340PWPR

Place of Origin:Multi-origin

... of ±3% - Up to 95% Efficiency - Operating Temperature Range of -40°C to 125°C - Small Footprint with 2.9mm x 3.8mm QFN Package - Low Operating Current of 1.3μA - Output Voltage Soft Start - Over-Temperature and Over-Current Protection Why buy from

Brand Name:SCXK

Model Number:P1.875

Place of Origin:China

...8mm P2mm P2.5mm Indoor LED Display SMD1515 High Definition Large Video Screen Wall GOB Technology Introduction New Arrival GOB technology and what's it ? GOB means Glue On Board. It is a kind of packaging technology to solve the problem of LEDs protection. It uses an advanced new transparent material to package the substrate...

Brand Name:Original Factory

Model Number:BMP388

Place of Origin:CN

.... The sensor module is housed in an extremely compact 10-pin metal-lid LGA package with a footprint of only 2.0 × 2.0 mm² and max 0.8mm package height. Its small dimensions and its low power consumption of 3.4 µA @1Hz allow the implementation in

Brand Name:Microchip

Model Number:ATSAMD20J16A-AUT1

Place of Origin:USA

Product Description: Integrated Circuit IC is a technology that brings together miniature electrical components, such as transistors, capacitors, and resistors, onto a single substrate. It is a crucial element in the modern world, with its applications in ...

Brand Name:CAEC

Place of Origin:China

...IC chip, fine ceramic, optical glass, gem, metal and cemented carbide. Main features Good surface quality and high efficiency Heat dissipated quickly Easy to clean and no poisonous materials contained Complies with RoSH standard. Package: in bottles Spec:

Brand Name:Hiner-pack

Model Number:HN1979

Place of Origin:Made In China

...Standard LGA IC Semiconductor Tray HIPS Materials Non ESD Customized JEDEC Standard Design Tray For LGA IC Parts Detail description Outline Line Size 322.6*135.9*12.19mm Brand Hiner-pack Model HN1979 Package Type LGA IC Cavity Size 77*84*4.8mm Matrix QTY...

Brand Name:zmsh

Model Number:2inch 2°off

Place of Origin:china

2°off C-plane orientation 2inch sapphire wafer for epi-ready, customized orientation Al2O3 single crystal wafer ,sapphire thick glass lens for covering,sapphire optical windows About Our Company We can provide single crystal sapphire wafer to ...

Brand Name:LITEON

Model Number:LTST--C190EKT

Place of Origin:Thailand

LTST--C190EKT Super thin (0.55H mm) Chip LED, Compatible with infrared and vapr phase reflow solder process FEATURES Super thin LED chip Package in 8mm tape on 7" diameter reels Compatible with autometic placement equipment Compatible with infrared and ...

Brand Name:AVAGO

Model Number:ACPL-W314-500E

Place of Origin:CHINA

ACPL-W314-500E 600mA Gate Driver Optical Coupling 5000Vrms 1 Channel Features · High speed response. · Ultra high CMR. · Bootstrappable supply current. · Available in Stretched SO-6 package · Package Clearance/Creepage at 8mm (ACPL-W314) · Safety Approval...

Brand Name:3nh

Model Number:NR60CP

Place of Origin:P.R.China

...8mm and 4mm Aperture Instrumental analysis is an important element in laboratory ink production and necessary for predicting various performance outcomes. Variables such as high-level press speeds and the many variations in substrates used in today’s commercial labels and packaging...