3x3mm fccsp package substrate

Brand Name:Horexs

Place of Origin:china

FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate...

Brand Name:Texas Instruments

Model Number:TPS63070RNMR

Place of Origin:China

TPS63070RNMR Buck-Boost Converter 2.5-12V Input 2A Switch 96% Efficiency 1.8-5.5V Adjustable Output Power Save Mode 25andmu;A IQ Forced PWM 3x3mm QFN Package andnbsp; Features andbull; InputVoltageRange:2.0Vto16V andbull; OutputVoltageRange:2.5Vto9V ...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:Mingseal

Model Number:GS600SU/SUA

Place of Origin:China

... CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow ...

Categories:IC Integrated Circuits

Country/Region:china

... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core...

Brand Name:Texas Instruments

Model Number:AM6252ATCGHAALW

Place of Origin:USA

... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C

Place of Origin:CN

Brand Name:Original Factory

Model Number:TX08DACP

TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ...

Brand Name:Original Factory

Model Number:TMS320C6203BGNY300

Place of Origin:China

TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Brand Name:Cmark

Model Number:camrk

Place of Origin:China

...some flavoring of instant noodle. Features: 1. Size: Cross, 5x5mm, 10x10x3mm,3x3mm or as customers' request. 2. Package: Carton 3. Moisture: max 7% 4. Brand: Cmark foods 5. Packing method: 25kgs/carton, 2 plastic clear inner bags. Flaver: ...

Brand Name:ZL

Model Number:ZL-2303

Place of Origin:China

GB / T1720 - 88 Manual or electric Operation Film Electric Adhesion Tester Equipment Description: Electric film adhesion tester, determination of Planning circular path through the film adhesion properties. To Yuangun line scratches integrity within the ...

Brand Name:SJK

Model Number:SJK-SFDCC6C433.92MA6

Place of Origin:China

3*3mm DCC6C SAW Filter 433.92MHz BW:300KHz,-40~+125℃ AEC-Q200 for automotive Applicaion: GPS, CLONASS GSM, CDMA, DCS, FDD, TDD,Automotive Features  Low-loss SAW filter  Low amplitude ripple  No matching network required for operation at 50Ω  Ceramic ...

Categories:PCB Depanelizer

Country/Region:china

... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The

Brand Name:PRM

Model Number:CuMoCu

Place of Origin:China

...MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electrical conductivity and is easy to ...