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All bga package datasheet wholesalers & bga package datasheet manufacturers come from members. We doesn't provide bga package datasheet products or service, please contact them directly and verify their companies info carefully.
| Total 5154 products from bga package datasheet Manufactures & Suppliers |
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Brand Name:Original Factory Model Number:APL1096/343S00474 Place of Origin:CN ...BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA... |
ShenZhen Mingjiada Electronics Co.,Ltd.
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Categories:BGA Assembly Country/Region:china ...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA... |
DQS Electronic Co., Limited
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Brand Name:XILINX / AMD Model Number:XC6SLX150-2FGG676I Place of Origin:original ...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package... |
Shenzhen Sai Collie Technology Co., Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:CESGATE Model Number:NA Place of Origin:China BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ... |
Chengdu Cesgate Technology Co., Ltd
Sichuan |
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Brand Name:Ziitek Model Number:TIF030-05 Place of Origin:China 3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ... |
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Guangdong |
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Brand Name:Bicheng Model Number:BIC-954.V1.0 Place of Origin:CHINA SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A... |
Bicheng Electronics Technology Co., Ltd
Guangdong |
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Brand Name:Hiner-pack Model Number:HN23111 Place of Origin:SHENZHEN CN Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devices such as integrated circuits (ICs), safe ... |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |
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Brand Name:Analog Devices Model Number:LTM4622IY Place of Origin:China ... Regulator with 95% Efficiency 3.1-20V Input andplusmn;1.5% Output Accuracy 2.5MHz Switching and 6.25mm andtimes; 6.25mm BGA Package andnbsp; FEATURES n Complete Solution in andlt;1cm2 n Wide Input Voltage Range: 3.6V to 20V n 3.3V Input Compatible with ... |
TOP Electronic Industry Co., Ltd.
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Place of Origin:Malaysia Brand Name:N/A Model Number:MPC8260AZUPIBB MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit ... |
Mega Source Elec.Limited
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Brand Name:ELPIDA Model Number:E1116AEBG-8E-F Place of Origin:China New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products, we carry many electronic components from the ... |
STJK(HK) ELECTRONICS CO.,LIMITED
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Brand Name:Qualcomm Model Number:CSR8645B04-IBBC-R Place of Origin:USA CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute ... |
QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
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Model Number:ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Place of Origin:Malaysia ...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package... |
HK NeoChip Technology Limited
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Brand Name:ADI Model Number:ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Place of Origin:Malaysia ...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package... |
Angel Technology Electronics Co
Hongkong |
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Brand Name:Jiaqing Circuit Place of Origin:China BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture ... |
Shenzhen Jiaqing Circuit Co., Ltd.
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Brand Name:QUALCOMM Model Number:IPQ4019-0vv Place of Origin:AMERICA
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G-Resource Electronics Co.,Ltd
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Brand Name:KIOXIA Model Number:THGBMTG5D1LBAIL Catalogue eMMC Interface type eMMC 5.0 Storage capacity 4GB Working temperature-25℃ ~+85℃ Sequential reading speed 152 MB/s Sequential writing speed is 14 MB/s NAND working voltage (VCCF) is 2.7V ~ 3.6V. The working voltage (VCCQ) of the controller is 2.7V... |
Shenzhen Hefengxin Technology Co., Ltd.
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Brand Name:Bicheng Enterprise Limited Model Number:BIC-0330-V3.30 Place of Origin:China Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ... |
Shenzhen Bicheng Electronics Technology Co., Ltd
Guangdong |
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Place of Origin:China ...BGA Assembly – Any Quantity Welcome Overview Every BGA assembly project is unique—different BGA packages, board constructions, and quantity requirements. Studio Electronics offers Custom BGA Assembly—any BGA type, any specification, any quantity. As a specialized provider of PCB assembly in China, we handle BGA... |
Studio Technology Co., Ltd.
Guangdong |