bt wire bonding substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

... packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),...

Brand Name:HuanYu Dream

Model Number:HY-7070W45L1000-9W

Place of Origin:China

...Wire EMC Substrate SMD LED Key Features 1.Specifications: 7070 package, 9W power, 30V voltage. 2.Light Color: 4500K neutral white. 3.Materials: EMC bracket, gold wire bonding. 4.Advantages: High reliability, long lifespan. Product Specifications Attribute Value Type High Voltage 7070 SMD LED CHIP Color 4500K Power 9W Substrate...

Brand Name:WINNER

Model Number:WNE T10

Place of Origin:CHINA

...Bonding Wire with High Conductivity for Wire Bonding Applications Optimize semiconductor packaging performance with our Ultra Pure Aluminum Bonding Wire (99.999% purity), engineered for superior electrical conductivity and thermal stability in high-density integrated circuits. Designed for wire bonding processes, this aluminum wire...

Model Number:610dh

Place of Origin:China

Brand Name:CHUANGLIYOU

...Bonding Machine is used to repair all type TV and Laptop LCD Panel faults. This is automatic machine and set required Temperature and Pressure as per requirement of the PANEL BONDING MODE. Wire Bonding Machine Main Features • Pulse Heat ACF TAB FPC COF Bonding Machine for LCD LED TV Screen Repair • Design for LCD/LED TV PANEL repair. • Bonding...

Brand Name:WITGAIN PCB

Model Number:PCB000033

Place of Origin:China

...Printed Circuit Board With Wire Bonding Main Features: 1 2 Layer FR4 substrate material printed circuit board. 2 Double layer copper, copper thickness is 35um/35um. 3 Finished pcb thickness is 1.6mm. 4 PCB with wire bonding. 5 Immersion Gold treatment 6 2 ...

Brand Name:NEWFILM

Place of Origin:China, Guangzhou

...Gloss Coextruded Thermal Bonding Substrate | ISO 18916-Certified Photochemical Stability for Haute Couture Packaging & Heritage Conservation Systems Item Advanced Surface-Engineered Tactile-Low-Gloss Coextruded Thermal Bonding Substrate | ISO 18916-...

Brand Name:Onetop

Model Number:ONT-WB938

Place of Origin:SHENZHEN,CHINA

Hot sale electric car battery pack ultrasonic aluminum wire bonding machine Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through...

Brand Name:ASM

Model Number:AB550

Place of Origin:China

... related equipment. Among our featured machines are original and used ASM AB550 Automatic Wire Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is

Brand Name:ZT

Model Number:ZT-DHJ030

Place of Origin:China

... gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic bonding, achieving ±1μm positioning accuracy for fine-pitch bonds (e.g., 25μm pitch in semiconductor packaging). Semi-Automatic Operation:

Brand Name:Mingseal

Model Number:GS600M

Place of Origin:China

...Wire Bonding Gold Wire Encapsulation The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced wire bonding applications. Equipped with a high-resolution visual alignment system, the GS600M detects fine wire...

Brand Name:Dongho

Model Number:TH-M2048

Place of Origin:China

...Wire Bonding Machine For Wire Terminal Welding 20kHz 4800W Ultrasonic Wire Bonding Machine For Wire Terminal Welding Technical Parameters: Keyword Ultrasonic Wire Bonding Machine Model TH-M Frequency 20KHz Power 4800W Welding Force 1200 Newton Max. Control Voltage 24V Welding Stroke 30mm Cross Section Wire 0.35mm²-75mm² Wire...

Brand Name:KINGFEI

Place of Origin:China

Model Number:WB-3D

Wire bonding inspection equipment SMT Equipment WEBER 3D AOI Equipment Characteristics 1.High-density marble platform provides assurance for high-precision 2.Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results 3.The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding...

Brand Name:Altrasonic

Model Number:HS-2020

Place of Origin:China

...Wire Bonding Splicing Metal Welding Machine Description: Ultrasonic Metal Welding is the future-oriented method for wire and terminal applications. The welding machine is a new industrial ultrasonic wire splice solution. It welds stranded, braided and magnet wires to create a wire splice, wire...

Brand Name:SUPT MOTION

Model Number:VCAB0033-0224-00A

Place of Origin:china,Suzhou

Product Description: Linear voice coil motors are widely used in semiconductor crystal solidification machines and wire bonding machines. For the wire welding process customized development of voice coil motor and linear motor direct drive system, motion ...

Brand Name:WITGAIN PCB

Model Number:P02E3980A0

Place of Origin:China

... Solder Mas: Green Surface Treatment: ENIG(1U')+Hard Gold(10U') Application: LCD Module IC Treatment: Wire Bonding Unit Size: 120mm*50mm/3pcs Our Factory: FAQ: Question: What is

Brand Name:Unicomp

Model Number:AX7900

Place of Origin:China Guangdong

Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg ...

Brand Name:CNJACKY

Model Number:CNJ-Full Auto Bonding Machine

Place of Origin:Hubei, China

Servo Positioning Full Auto Chip Filling Antenna Wire Bonding Machine For Smart Card Feature: The full auto bonding machine use to weld the antenna and modules of contactless cards. With the double pulse current inverter welding, the machine is steady. The...

Brand Name:YJJ

Model Number:AFM0200

Place of Origin:CHINA

Product Description: YJJ AFM0200 Gas Micro-Flow Thermal Type Sensor And Oxygen Air Flow Quality Sensor Is Used In Equipment Such As Wire Bonding Machines Features: AFMO200 Micro Flow Sensor Resistant to high and low temperatures, with good linearity, and ...

Brand Name:LERANEW

Model Number:LN-SMD3030SB-P1-E35

Place of Origin:CHINA

... ANGLE 120° Design Advantage : PCT leadframe for better heat transfer. Standard A Class chips. Cost performance. Gold wire bond. Special lens for light distributio

Brand Name:ELT

Model Number:JMC-293-JH

Place of Origin:China

4 Pins Nail Head Hermetic Multi Pin Headers with Gold Wire Bonding Surface Hermetic Multi-pin Headers / Glass to Metal Seals RF / DC Feedthroughs /Glass Beads is also called Glass insulator, Hermetic Header. They are mainly used to transmit microwave ...