cpu thermally conductive gap filler pads

Brand Name:Ziitek

Model Number:TIF100 6520-11

Place of Origin:China

...Thermal Conductive Gap Filler Pad For LED CPU GPU EV Battery TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal

Brand Name:Ziitek

Model Number:TIF1100-07E Series

Place of Origin:China

... thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and

Brand Name:Ziitek

Model Number:TIF100-18-11U

Place of Origin:Vietnam

... interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can ...

Brand Name:Laird

Model Number:A178XX-XX

Place of Origin:China

... line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird's unique manufacturing capabilities, filler and

Brand Name:AOK

Model Number:TM300

Place of Origin:China

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m

Place of Origin:USA

Brand Name:Dowsil

Model Number:Tc-4525

Dowsil TC-4525 Thermally Conductive Gap Filler for Automotive Electronics Cooling​ Product Attributes Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m·K, low compression stress, and controlled ...

Brand Name:PF

Model Number:BERGQUIST SP2000

Place of Origin:Guangdong,China Mainland

... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *

Brand Name:Adcol

Model Number:A-gapfill 600

Place of Origin:China

Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal...

Brand Name:Trumonytechs

Model Number:301-0200

Place of Origin:China

...Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate Discription of Thermal Gap Filler Pads: Thermal Gap Filler Pads is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and Thermal Gap Filler Pads effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. Thermal Gap

Brand Name:HUITIAN

Model Number:5270

Place of Origin:CHINA

5270 TDS-EN.pdf 5270 is a two-component silicone thermal conductive gel, which has high thermal conductivity and low density Product Description Silicone thermal conductive two-component gel Low transient/static stress Two-part 1: 1 mix Product Features: ...

Model Number:M-TP300

Place of Origin:China

...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap filler...

Brand Name:Race

Model Number:Silicone thermal pad

Place of Origin:Guangdong, China

...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal conductivity...

Brand Name:KKG

Model Number:802

Place of Origin:Dongguan

...Cpu Silica Gel Thermally Conductive Pad Thermal interface silicone material is high-performance, thermal conductive gap filling materials. Mainly for the transmission interface between the electronic equipment, and heat sink or product outer coving. With nice stickiness,flexibility,good compression performance and excellent heat conductivity...

Brand Name:Aorun

Model Number:Aorun

Place of Origin:China

...Gap Filler Ab Glue Potting Compound Thermal Conductivity Quick Detail: Name Epoxy Resin AR83 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: Thermal conductive...