disco wafer dicing

Brand Name:Hongtuo

Model Number:HT-WSB

Place of Origin:China

... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,

Brand Name:Hiner-pack

Model Number:HN24725

Place of Origin:Made In China

... processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use. Semi-Wafer Cutting Frame Ring (1)This wafer dicing frame is

Brand Name:ZMSH

Model Number:Microjet laser technology equipment

Place of Origin:CHINA

Abstract of microjet laser technology equipment Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale ...

Brand Name:KHJ

Model Number:KHP996MS

Place of Origin:China

... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of

Brand Name:TONGYU INDUSTY

Model Number:RTR1A8-006

Place of Origin:CHINA

0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility...

Brand Name:ZMSH

Place of Origin:China

Automated Precision Dicing Machine​ ​High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics...

Place of Origin:Henan, China

Brand Name:HDF

Certifications Product Description The vegetable cutting machine can accurately cut "slices, silk, strips" and work efficiently. The speed of the conveyor belt and the speed of the turning knife are adjusted by the frequency converter, and can be ...

Brand Name:CXDLV

Model Number:H71H

Place of Origin:China

stainless ss wafer disco lift type check valve for water Check Valve Features XIDELONG H71H LIFT CHECK VALVE Model No H71H Type Non-return Valve MOQ 1 Set Applicable Standard ASME Port Size DN15~DN300 End Connection Wafer Working Pressure PN16~PN64.150LB~...

Brand Name:YUSH

Model Number:YSL-1000SD

Place of Origin:JiangSu

... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system

Categories:PCB/PCBA Cleaning Machine

Country/Region:china

... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Auto dicing Auto-dicing system, refers to a dicing system which all

Brand Name:Perfect Laser

Model Number:PE-20W/50W

Place of Origin:China

Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation ※Product Introduction Solar technologies use the sun's energy to provide heat, light, hot water, electricity, and even cooling, for homes, businesses, and industry. Despite ...

Brand Name:CAEC

Place of Origin:Henan, China

... as carrier tape and protective substrate during the dicing and grinding process. UV tape is mainly composed of release film, acrylic adhesive and base film. Main application Semiconductor: Dicing of various types of package(BGA/QFN/DFN), wafer sawing and

Brand Name:OEM

Model Number:H74

Place of Origin:Shanghai , China

CF8 PN40 Wafer Disco Check Valve For Petroleum Or Vapour , SUS304 Single Disc​ Application: Valve is used for preventing the back-going of medium in pipelines and equipments, and the pressure of ...

Brand Name:Mingrui

Model Number:XF-576

Place of Origin:China

... of semiconductor production for adsorption and load. It is applied to thinning, dicing and other processes. The sucker produced by our company can be matched with Japanese, German and domestic equipment, and has superior cost performance advantages.

Brand Name:ZG

Model Number:MS

Place of Origin:China

... sophisticated. Ceramic chucks are used as loading fixtures when processing wafers. The adsorption area of the ceramic chuck is made of microporous ceramic that is permeable to air and water, while the outer ring of the ceramic chuck is sealed with dense,

Brand Name:Jiuying

Model Number:TJ-311

Place of Origin:Guangzhou,China

...need to cut potato chips, lotus root chips, lemon wafers and other wafers. In addition, it can also cut slices, strips and dices of rhizome vegetables. The cut surface is smooth and beautiful. Technical Parameter Motor: 220V 1HP Output: 300-800kg Weight: ...

Brand Name:Lead Laser

Model Number:LD-MK-UV3010

Place of Origin:China

... and other polymer bottles’ surface. Marking effect is fine, clear and solid, which is better than the injekt printing and no pullution produced. Also used in marking and dicing flexible PCB board, drilling tiny hole or blind-hole on silicon wafers, two

Brand Name:HUAHAI LASER

Model Number:UV laser HW-03P, 05P, 10P

Place of Origin:Wuhan, China

...polymer bottles’ surface. Marking effect is fine, clear and solid, which is better than the injekt printing and no pullution produced. Also used in marking and dicing flexible PCB board, drilling tiny hole or blind-hole on silicon wafers, two-dimensional