enepig fccsp package substrate

Brand Name:Horexs

Place of Origin:china

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:Mingseal

Model Number:GS600SU/SUA

Place of Origin:China

... CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow ...

Categories:IC Integrated Circuits

Country/Region:china

... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core...

Brand Name:Texas Instruments

Model Number:AM6252ATCGHAALW

Place of Origin:USA

... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C

Place of Origin:CN

Brand Name:Original Factory

Model Number:TX08DACP

TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ...

Brand Name:Original Factory

Model Number:TMS320C6203BGNY300

Place of Origin:China

TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Brand Name:Bicheng

Place of Origin:CHINA

Introducing the newly shipped RF PCB.Which is built is built on 31mil rogers DiClad 870 substrates. Designed with a focus on achieving lower dielectric constants, the DiClad 870 PCB offers exceptional electrical properties for a wide range of applications...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Brand Name:ZL

Model Number:ZL-2303

Place of Origin:China

GB / T1720 - 88 Manual or electric Operation Film Electric Adhesion Tester Equipment Description: Electric film adhesion tester, determination of Planning circular path through the film adhesion properties. To Yuangun line scratches integrity within the ...

Categories:PCB Depanelizer

Country/Region:china

... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The

Brand Name:PRM

Model Number:CuMoCu

Place of Origin:China

...MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electrical conductivity and is easy to ...

Brand Name:Delicacy

Model Number:TINPLATE

Place of Origin:CHINA

...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging...

Place of Origin:Guangdong

Brand Name:Lion King

...substrates like plastics, metal foils, and paper. It combines vacuum evaporation, sputtering, or plasma-enhanced techniques to create functional films for packaging, electronics, and renewable energy applications. Working Principle Continuous Substrate Handling: The substrate