enig bga substrate

Brand Name:WITGAIN PCB

Model Number:SSDPCB00013

Place of Origin:China

... Layer Count: 1 Layer Printed Circuit Board Finished Board Thickness: 1.8mm Copper Thickness: 1 Material: Copper Substrate Application Area: Hign Power LED Special Feature: Thermoelectric Separation Surface Treatment: ENIG Our Product Categories:

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

FR4 ENIG BGA craft EMS Double Side PCB Assembly for electronics Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the ...

Brand Name:Shinelink

Model Number:SL0925S02

Place of Origin:China

OEM PCBA IC BGA PCB Assembly 10 Layers FR4 Electronics X-ray Inspection SHINELINK offer complete end-to-end manufacturing solutions including material procurement,printed circuit board assembly (PCBA), box-building, system level test, cable and other par...

Place of Origin:China

Brand Name:Customized

Aluminum PCB Aluminum Substrate Board 1.0mm 10z 1w JUDING ENIG Aluminum PCBs can dissipate heat more effectively than traditional PCBs, allowing them to be used in various applications. This makes them ideal for use in high-...

Brand Name:Abis

Model Number:Multilayer PCB

Place of Origin:Made in China

Customized Multi-Layer PCB, Immersion Gold HDI Printed Circuit Board Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. We have two factories together,...

Brand Name:XCE

Model Number:XCEM

Place of Origin:China

... PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its

Brand Name:OEM ODM

Model Number:PCB-J-044

Place of Origin:China

...ENIG Electronic Printed Circuit Board with BGA Detail Specifications: Layers4 Material FR-4 Board Thickness 1.6mm Copper Thickness 1oz Surface Treatment ENIG Soldmask & Silkscreen Green & White Quality Standard IPC Class 2, 100% E-testing Certificates TS16949, ISO9001, UL, RoHS 4 layers 1.6mm FR4 1oz ENIG Electronic Printed Circuit Board with BGA...

Brand Name:Huashengxin

Model Number:135353

Place of Origin:China

Small Via BGA ENIG Quick Turn Pcb Fabrication 6 Layer Circuit Board 1.6mm Quick Turn PCB Boards Small Via And BGA ENIG Board Quick Turn Pcba Quick Turn Pcb Assembly 6 Layer Quick Turn Black Board HSX Circuit covers a total production area of 10,000 square ...

Place of Origin:Shenzhen ,China

Brand Name:OEM,ODM

Model Number:zt-pcb-0175

....8 layers printed Circuit Board PCB.enig multilayer pcb manufacturer 1.Fast PCB Fabrication for Samples and Mass Production 2.Electronic Components Sourcing Servics 3.PCBA Assembly Services:SMT,DIP,BGA... 4.Function Test 5.Stencil and Enclosure Assembly 6....

Brand Name:JIETENG

Model Number:FR4

Place of Origin:china

...ENIG 2u surface 0.075mm FR4 TG135 is a substrate material used in the manufacture of printed circuit boards (PCBs). Its glass transition temperature (Tg) of 135°C indicates that it can withstand moderate temperatures during operation without losing its mechanical or electrical properties. A 2-layer PCB made with FR4 TG135 material refers to a PCB with two layers of substrate material and copper traces. ENIG...

Brand Name:Linked Electronics

Model Number:LPCB1446

Place of Origin:China

0.057 Inch S1000-2 Material Rigid Flex PCB ENIG Rohs 35um 1OZ LPI Green BGA Introduction of Linked Electronics, the PCB Manufacture in China Linked Electronics is one of the leading suppliers of Electronic Printed Circuit Boards in China. Through our rich ...

Brand Name:Suntek

Model Number:F9632-12

Place of Origin:China

...ENIG Surface Finish SMT Parameters: Technology Circuit PCB/Flex/Metal PCB/Rigid-Flex Parameter Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA...

Brand Name:HUASWIN

Model Number:HSPCBA1072

Place of Origin:China

Automatic BGA SMT Assembly with ENIG PCBA for Touch Screen Ctonroller PCB Specifications - Contract Manufacturing - Engineering Services - PCB Design & Assembly - Product Design - Prototyping - Cable and Wire Assemblies - Plastics and Molds PCB capability...

Brand Name:OEM/ODM

Model Number:SL80227S008

Place of Origin:China

...ENIG Surface Finish Components used 1. Passives, smallest size 0201 2. Fine pitch to 08 Mils 3. Leadless chip carriers/BGA, VFBGA, FPGA and DFN 4. Connectors and terminals PCB Assembly services SMT Assembly Automatic Pick & Place Component Placement as Small as 0201 Fine Pitch QEP - BGA...

Brand Name:OEM

Model Number:Customized

Place of Origin:Guangdong China

... Via 0.1mm Surface treatment ENIG,OSP Board thickness 0.15-4.5mm Solder mask color Gree,Blue,Black,Red,White Tolerance of board ...

Brand Name:PCBA ,support OEM

Model Number:SFF Computer Motherboard PCBA

Place of Origin:Shenzhen, China

...ENIG Surface Finish PCB assembly forIndustrial Automation, Medical Devices 1.Product Features and Advantages (1) Compact Design & Space Efficiency Ultra-small form factor (e.g., Mini-ITX, Nano-ITX, or custom sizes <100mm×100mm) for embedded systems, IoT devices, and portable electronics. High-density component integration (surface-mount technology, BGA...

Brand Name:WITGAIN PCB

Model Number:P06E2850A0

Place of Origin:China

...ENIG 6 Layer Printed Circuit Board With Blind And Buried Holes PCB Specifications: Layer Count: 6Layer Half Plated Hole PCB Board Thickness: 1.2MM Material: FR4 NY3150A Min Hole: 0.1MM Min Line: 3/3 Mil BGA Size: 8Mil Unit Size: 90MM*60MM/20UP Blind Holes: L1-L2 , L5-L6 0.1MM Buried Holes: L1-L6 Solder Mask: Green Surface Treatment: ENIG...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA...