flip chip fccsp package substrate

Brand Name:Horexs

Place of Origin:china

...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable environmentally-friendly products (Halogen-free, Lead-free) ...

Brand Name:LEARNEW

Model Number:6060 SERIES

Place of Origin:China

...CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate ...

Brand Name:ZMSH

Model Number:SiC Ceramic Vacuum Chuck

Place of Origin:CHINA

SiC Ceramic Vacuum Chuck Abstract SiC Ceramic Vacuum Chuck ​​Flip-Chip Bonding Mirror Polishing High-Stiffness​​ A Flip-Chip Bonding Vacuum Chuck is a high-precision vacuum adsorption component specifically designed for ​​Flip-Chip Bonding processes​​ in ...

Brand Name:TYF

Model Number:TF

Product Description: Introducing our innovative Flip Chip Cob Led, a high power COB LED that sets a new standard in illumination technology. This cutting-edge product features advanced design and superior performance, making it the ideal choice for a wide ...

Brand Name:XUANCAI

Model Number:DL-20/11 led cob chip

Place of Origin:China

...Flip chip US Bridgelux 3 Years Warranty LED COB Chip 110-120lm/W CE ROHS Certificate Product Description Produce Name DL-20/11 Led cob chip Watts 3w Current 300mA Voltage 9-10v CRI 70 Lumens 110-120lm/W Chip Brand US Bridgelux Life Span 50000 hours Color Temperature 2700k / 3000K / 4000k / 6000K Specification ◆Mechanical Dimensions: R20.0x1.7(mm) ◆Package Structure:Aluminium Base Chip...

Brand Name:Tyanshine

Model Number:TX-6066RGBW250FC120-NUVENG-01

Place of Origin:CN

... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to

Brand Name:UNICOMP

Model Number:AX9100max

Place of Origin:China

... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic ...

Brand Name:Mingseal

Model Number:GS600SS

Place of Origin:China

Advanced Flux Jetting Dispenser for Warped Chip Flux Support The GS600 series is a next-generation inline flux jetting system designed to solve one of the most demanding challenges in semiconductor assembly: flux application on highly warped chips mounted...

Brand Name:GKG

Model Number:GD602D

Place of Origin:China

Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery High-Speed ​​Flexible Strip Die Bonder Product Features 1. Utilizes a sheet-to-sheet docking station with ...

Brand Name:Leyond

Model Number:LY-FL10010XX-BB

Place of Origin:China

...Flip Chip COB Cool White outdoor ip65 waterproof 150w led flood light with 107LM/W Product description 1. Basic information for LED Flood Light: Product name:10w led flood light Input Voltage:100-240v AC IP Grade:IP65 LED Qty:1 pcs 2. LED Chip for LED Flood Light: Import USA LED Bidgelux 45mil Chip/28mil Epistar chip ,lumens up to 90lm/w High brightness and low light decay Stable color temperature, long lifespan, best package

Brand Name:Original Factory

Model Number:XC6SLX9-2FTG256C

Place of Origin:CN

...Flip-Chip Product Description Of XC6SLX9-2FTG256C XC6SLX9-2FTG256C's DSP slice fundamentally consists of a dedicated 25 × 18 bit two's complement multiplier and a 48-bit accumulator, both capable of operating up to 741 MHz. Specification Of XC6SLX9-2FTG256C Part Number: XC6SLX9-2FTG256C Memory Interface: 800 Mb/s I/O Pins: 400 I/O Voltage: 1.2V–3.3V Package...

Brand Name:filamentlux

Model Number:FML-12V-COB-320

Place of Origin:China

LED STRIP LIGHT 12V COB 320PCS/m IP20 Stable performance, easy to assemble and use. Led surface light source of the overall package molding, to achieve a led lighting light source modular production, users do not need to use the secondary processing, the ...

Brand Name:Original Factory

Model Number:TMS320C6203BGNY300

Place of Origin:China

TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ...

Brand Name:WS

Model Number: 213

Place of Origin:CHINA

...Substrate Material: PET PVC Paper 3. Antenna Thickness: 0.03mm 4. Substrate Thickness: 0.03mm 5. Frequency: 14.0+/-0.5MHz 6. Reading Distance: 0---10CM Chip NFC Memory 144/504/888bytes Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip sid...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Brand Name:wuxi special ceramic

Place of Origin:Made in China

Product Description High Purity 99.7% Al2o3 Ceramic Substrate For LED Packages,Chip Resistors Alumina Ceramic: Alumina ceramics are classified into high-purity type and ordinary type. The high-purity alumina ceramics have a Al2O3 content of 99.9% or mor...

Brand Name:TI

Model Number:SN74HC374N

Place of Origin:Original

... Loads ►Full Parallel Access for Loading ►Package Options Include Plastic Shrink Small-Outline (DB), Small-Outline (DW), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J)

Brand Name:TI

Model Number:SN74HC374N

Place of Origin:Original

... Access for Loading ►Package Options Include Plastic Shrink Small-Outline (DB), Small-Outline (DW), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs description These

Brand Name:original

Model Number:MC100LVEL29DWR

Place of Origin:Original Manufacturer

...FLIP?FLOP WITH SET AND RESET High Light: computer integrated circuits , computer ic chip Quick Detail: 3.3V ECL Dual Differential Data and Clock D Flip?Flop With Set and Reset Specifications: Datasheets MC100LVEL29 Series Product Photos 20-SOIC Standard Package 38 Category Integrated Circuits (ICs) Family Logic - Flip Flops Series 100LVEL Packaging...

Brand Name:XILINX / AMD

Model Number:XC7A200T-2FBG484C

Place of Origin:Multi-origin

...count, a 484-pin flip-chip package, and an array of memory, high-speed transceivers, and programmable I/O. With its high-performance, low power consumption, and flexible design capabilities, this chip is ideal for applications in computing, communications,