fpga ic with 625 ball package

Brand Name:AMD

Model Number:XC2C512-10FGG324I

Place of Origin:original

XC2C512-10FGG324I Programmable IC Chip FPGA for Complex Logic Applications XC2C512-10FGG324I Programmable IC Chip • Package: 324-Pin FG Fine-Pitch Ball Grid Array • Speed Grade: 10 • Number of Logic Cells: 512 • Number of Macrocells: 8 • Clock ...

Brand Name:Original Factory

Model Number:XA7S25-1CSGA324I

Place of Origin:CN

...FPGAs Chip 324LFBGA IC Chip​ Product Description Of XA7S25-1CSGA324I XA7S25-1CSGA324I include 36Kb (2 x 18Kb) block RAMs with built-in FIFO logic for on-chip data buffering, DSP slices with 25 x 18 multiplier. Specification Of XA7S25-1CSGA324I Part Number: XA7S25-1CSGA324I Number Of I/O: 150 Package / Case: 324-CSPBGA (15x15) Distributed RAM(Max): 313Kb Ball...

Brand Name:Intel

Model Number:EP4CE40F23I7N

...IC FPGA 328 I/O 484FBGA Intel Product Details Description: The Altera EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-power FPGA...

Categories:Xilinx Ic

Country/Region:china

Product Attribute Attribute Value Select Attribute Manufacturer: Xilinx Product Category: SoC FPGA Shipping Restrictions: This product may require additional documentation to export from the United States. RoHS: Details Mounting Style: SMD/SMT Package / ...