gpu cpu thermal gap filler

Brand Name:Trumony

Place of Origin:Jiangsu，China

...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal...

Brand Name:ZIITEK

Model Number:TIF™540US Series

Place of Origin:China

CPU Silicone Rubber Thermal Gap Pad TIF540US 2.95 g/cc Cooling High Adhesive 2.6W/mK for Automotive engine control units The TIF™540US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the ...

Brand Name:Ziitek

Model Number:TIF520-20-11US

Place of Origin:China

... in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our ...

Brand Name:Ziitek

Model Number:TIF700P

Place of Origin:Vietnam

...Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Thermal Gap Filler Product descriptions TlF700P is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal...

Brand Name:PF

Model Number:BERGQUIST SP2000

Place of Origin:Guangdong,China Mainland

... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *

Brand Name:AOK

Model Number:TM

Place of Origin:China

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0

Brand Name:Adcol

Model Number:A-gapfill 600

Place of Origin:China

... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and

Brand Name:Laird

Model Number:A184XX-XX

Place of Origin:China

... Based Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity...

Brand Name:HUITIAN

Model Number:0112

Place of Origin:CHINA

0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: paste; Wide working temperature range; Nontoxic...

Place of Origin:USA

Brand Name:Dowsil

Model Number:Tc-4525

Dowsil TC-4525 Thermally Conductive Gap Filler for Automotive Electronics Cooling​ Product Attributes Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m·K, low compression stress, and controlled ...

Brand Name:XCWY

Model Number:S0006

Place of Origin:Hebei,China

Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ...

Brand Name:LF

Model Number:LF-ET0525

Place of Origin:Guangdong, Mainland China

Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ...

Brand Name:KKG

Model Number:12620

Place of Origin:Dongguan

OEM / ODM Laptop GPU CPU Silica Gel Thermally Conductive Pad​ Product Name adhesive backed rubber pad Color Black Hardness 50-70Shore Product Form Rollstock Roll ...

Brand Name:PLYFIT

Model Number:A0101/A0102/A0104l

Place of Origin:Guangdong China

...gap filler compressed extruded PU Foam Spray for Construction Art No. A0101 300ml/A0102 500ml/A0104 750ml Advantage of product: Multipurpose large expansion PU foam sealant is an one-component, self-expanding,multipurpose polyurethane foam. This foam will expand and cure by moisture in the air. It is used for a wide range of building applications. It is very good for filling and sealing with excellent mounting capacities, high thermal

Model Number:M-TP300

Place of Origin:China

...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap filler...

Brand Name:Race

Model Number:Silicone thermal pad

Place of Origin:Guangdong, China

...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal...

Brand Name:dell

Model Number:PowerEdge R440

Place of Origin:Beijing, China

Original PowerEdge R440 server Silver 4108 Processor 1.8 GHz cpu 1tb HDD 8GB RAM Rack Server Specification Processor Intel® Xeon® Bronze 6136 3.0G, 12C/24T, 24.75M Cache, Turbo, HT (150W) DDR4-2666 Memory 8GB RDIMM, 2666MT/s, Single Rank 16GB RDIMM, 2666MT...

Brand Name:Neardi

Model Number:LPB3399PRO

Place of Origin:Shanghai, China

...GPU ARM Mali-T860MP4 GPU LPB3399Pro Industrial Box PC: High-Performance, Fanless Edge Computing Solution The LPB3399Pro Industrial Box PC, powered by the Rockchip RK3399Pro platform, is a rugged, industrial-grade computing system designed for AI-driven edge applications. Featuring a full-aluminum, fanless design, it efficiently dissipates heat by channeling thermal energy from key components like the CPU...

Brand Name:Guanbiao

Model Number:M3X15

Place of Origin:China

...Thermal Management Fasteners For Heat Sinks & PC Hardware 1. Application Scenarios Our high-performance spring screws are specifically engineered for thermal management systems, ensuring optimal heat dissipation in demanding computing environments: CPU/GPU...