ic package substrate 0 29mm

Brand Name:Horexs

Place of Origin:china

..., special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate. Application: Dram memory electronics Sd card memory card all kind of

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Place of Origin:Guangdong, China

Brand Name:Hunter Men

Model Number:HT09-50

..., our hot melt adhesive film can bonding the two kinds materials very well after hot pressing. Apperance: Transparent film with release papaer Width: 29mm, Length: 100meters/rolls, Core Inner Diameter: 3” Strength: >

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:Original Factory

Model Number:PEX89048A0

Place of Origin:CN

...PEX89048A0 Lanes 48 Latency 115ns NT Ports 4 Packaging Size 29mm x 29mm Ports 48 Power Typ. 23.7 Features Of PEX89048A0 Create basic switch topologies at PCIe 5.0 rate (32 GT/s) to ...

Brand Name:Microchip

Model Number:ATSAMD20J16A-AUT1

Place of Origin:USA

Product Description: Integrated Circuit IC is a technology that brings together miniature electrical components, such as transistors, capacitors, and resistors, onto a single substrate. It is a crucial element in the modern world, with its applications in ...

Brand Name:CAEC

Place of Origin:China

...IC chip, fine ceramic, optical glass, gem, metal and cemented carbide. Main features Good surface quality and high efficiency Heat dissipated quickly Easy to clean and no poisonous materials contained Complies with RoSH standard. Package: in bottles Spec:

Model Number:STK4152II

Place of Origin:china

Description: The STK4102II series (STK4152II) and STK4101V series (high-grade type) are pin-compatible in the output range of 6W to 50W and enable easy design. Small-sized package whose pin assignment is the same as that of the STK4101II series. Built-in ...

Brand Name:Unicomp

Model Number:UNMS-U110B

Place of Origin:China

... to check IC Quality Key Parameter: Max. Tube Voltage: 110kV Max. Tube Power: 25W Beam Angle: 110±3° Min. Spot Size: ≤5μm Beam Angle: 110±3° Applications: SMT, PCBA ,Electronic Manufacturing Integrated Circuit Package IGBT Substrate / Module EV...

Brand Name:CKS

Model Number:CKS-Customized-4

Place of Origin:CHINA

... circuit boards, HDI high-density boards, IC packaging board, FPC board, Rigid-Flex PCB, ceramic substrate, copper substrate, aluminum substrate, and SMT patch & DIP processing services for customers. Focused on: one-stop service,including pcb fabrication

Brand Name:JUK

Model Number:KE2010-2060

Place of Origin:JAPAN

...Substrate size: 50×30 ~ 330×250mm Substrate thickness: 0.4 ~ 4mm Component size: 0402 ~ 20mm square components or 26.5 × 11mm IC / BGA / CSP Mounting speed: 11000CPH Mounting accuracy: 0.05MM / 0.03MM (for image recognition) Component type: 80 types (up to 100 types using MTC) Component packaging: belt

Brand Name:Krunter

Model Number:KVP200H12E4-3TB

...Compact Package Low Switching Loss Assembled in PCB Integrated NTC temperature sensor Isolated Baseplate by Al2O3 substrate Specification Parameters TYPE T1, T4 T2, T3 Circuit Package Technology VCES Volts IC Amps VCE(SAT) Volts Ptot Watts VCES Volts IC ...

Brand Name:OURS ULTRASONIC

Model Number:ARS-DQXJ-1024

Place of Origin:China

...ts, such as semiconductor tube shell, IC shell, crystal shell, relay shell, electronic tube, etc. Substrate cleaning of electronic components of ultrasonic cleaner: the substrate of electronic components is made of semiconductor materials and packaged in

Brand Name:ETON

Model Number:YT202S

Place of Origin:China

... such as transistors, resistors, capacitors and inductors required in a circuit are interconnected, fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a package. , become a miniature structure with

Brand Name:Anterwell

Model Number:2SA1736

Place of Origin:original factory

...Low saturation voltage: VCE (sat) = −0.5 V (max) (IC = −1.5 A) • High speed switching time: tstg = 0.2 μs (typ.) • Small flat package • PC = 1.0 to 2.0 W (mounted on a ceramic substrate) • Complementary to 2SC4541 Absolute Maximum Ratings (Ta...