ic test sockets for semiconductor testing

Brand Name:Yiding

Place of Origin:Guangdong, China

IC Test Socket Leading Semiconductor Brand — Yiding Technologies In the fast-evolving semiconductor industry, Yiding Technologies stands at the forefront with precision engineering and innovative solutions, delivering high-frequency test sockets and comprehensive semiconductor application services. Our Services Semiconductor Manufacturing & Processing Test Fixtures & Spring Probes Vertical Probe Cards High-Frequency Test Socket Automated Test

Place of Origin:China

Brand Name:Shiye

...Semiconductor Testing Socket Compatible with automated testing equipment, our IC test socket connectors provide reliable testing connectivity solutions for semiconductor testing, chip validation, electronic R&D, and automated inspection equipment. Product Overview We specialize in the R&D and custom manufacturing of high-precision IC test sockets...

Model Number:BGA132/BGA152/BGA88/BGA136 Test Socket

Place of Origin:CHINA

...Pin Count : 152/132 d) Applicable IC body width : 12*18/14*18 Characteristics are as below: 1. This product is for BGA152 adapter to dip48 solution, apply to BGA 152 adapter read and test. 2. Apply to Samsung, Sandisk, Hynix, Toshiba, Intel, etc. 3. It is

Brand Name:ANYO

Model Number:AY1001

Place of Origin:CHINA

2.54mm IC Test Socket ZIF Socket Connector With Center Distance 7.62/15.24mm Description: Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little force for insertion. With a ZIF socket, before the IC is inserted...

Place of Origin:china

Brand Name:n/a

Model Number:QFP44-0.8

... work temperature : -60~155 degree ITEM : QFP-44-0.8 PIN distance : 0.8mm , 44 pin IC size : 10*10mm/12*12mm we have too many kinds of test socket didn't show here . we can also do OEM socket for the customers . please welcome to contact with us for detail

Brand Name:Jrkconn

Model Number:PGA - 11 Series

Place of Origin:Guangdong, China

... in a grid pattern. These sockets allow for reliable electrical connections and easy insertion/removal of PGA-packaged chips. Common pitch sizes include 1.27mm to 2.54mm, and they are widely used in CPU testing, programming, and burn-in applications where

Model Number:PW-12

Brand Name:WINNER

Place of Origin:CHINA

Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire Adaptable to different bonding machine parameters, high stitch pull strength for BGA semiconductor test socket packaging. Company Information

Model Number:264-4205-00

...Sockets for QFN Applications are designed for testing and burn-in of Quad Flat No-lead (QFN) packages. This product family includes sockets for 0.4 mm and 0.5 mm pitch QFN devices, utilizing a common contact for both pitch offerings. These sockets are engineered for reliable performance in demanding test environments, as demonstrated by evaluation reports focusing on actuation force, contact force, IC

Brand Name:ASLi

Model Number:PCT-35

Place of Origin:China

... property for multi-layer circuit board, IC sealing package, LCD screen, LED, semi-conductor, magnetic materials, NdFeB, rare earths and magnet iron, in which the resistance to pressure and air tightness for above mentioned products can be tested out.

Place of Origin:Guangdong, China

Brand Name:China-CXD

Model Number:Custom

...Semiconductor Test Fixture Bases Semiconductor test fixtures operate at the intersection of three requirements that pull against each other: contact force, thermal stability, and cleanliness. A probe or socket array needs a base that stays flat at temperature, holds contact position within microns, and does not shed particles into the test environment. Our semiconductor test...

Place of Origin:Guangdong, China

Brand Name:Anti static soldering station tool

Model Number:IC Chip pick up pen

...IC Chip pick up pen BGA Vacuum Pump Suction Pen Vacuum Picker whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 IC Chip pick up pen : This vacuum pick-up pen is designed to handle parts when moving them into and out of burn-in trays, test sockets or other component transfer operations. Widely used in semiconductor field like SMT, IC...

Brand Name:TOPCBS

Model Number:BIB and test Boards

Place of Origin:Suzhou China

...additional factors for making a Burn in Board. One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board to fail before the device under

Brand Name:BOTO

Model Number:BT-HAST series

Place of Origin:China

...test chamber for Ic semiconductors Appliance: BT-HAST high-pressure steam testing machine test is to improve the environmental stress (such as: temperature) and work stress (applied to the product voltage, load, etc.), speed up the test process, shorten the product or system life test...

Place of Origin:CHINA

Brand Name:YOUBI

Model Number:UP-6124

...Testing of IC Packages Product Overview The HAST High Pressure Accelerated Aging Chamber evaluates operational reliability of non-gas-tight IC devices (solid-state devices) under high temperature and humidity conditions, performing high-accelerated stress life aging tests for components including non-biased chips and semiconductors. Applications IC Semiconductors

Model Number:HN25026

Brand Name:Hiner-pack

Place of Origin:China

...Semiconductor IC Testing Handling and Storage Protection Separate individual IC chips inside special slot structures. Prevent mutual friction and collision during frequent operational movements. Maintain stable performance under long‑term cyclic usage within semiconductor production lines. Isolate chips from external contact to cut surface‑damage risks. Fit continuous test...

Brand Name:CHENGFENG

Model Number:CF9046

Place of Origin:China

...test chamber is used to test the moisture resistance of semiconductor packaging. The products to be tested are placed under harsh temperature, humidity and pressure conditions. Moisture can seep into the package along the colloid or the interface between the colloid and the lead frame. Testing the sealing performance of multi-layer circuit boards, photovoltaic modules,EVA,IC...

Brand Name:Liyi

Model Number:400×350×300,400×500×400,500×600×500,500×750×600

Place of Origin:Guangdong, China

...Testing Equipment Tester Shock Test Machine Product Description The thermal shock test chamber is the perfect testing machine of electronic components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor...

Brand Name:Yamaha

Model Number:KM0-M880A-101

Place of Origin:Japan

SMT Spare Parts Yamaha IC KM0-M880A-101 Warranty: 6 months Usage: Yamaha SMT machine Quality: 100% Tested Brand Name: Yamaha Type: SMT machine parts Condition: Original new We also supply following Yamaha Spare parts : 91317-04008 BOLT HEX. SOCKET HEAD ...

Brand Name:BAXIT

Model Number:GLO-5027A

Place of Origin:Shanghai, China

..., diodes,LCD, chip resistance capacitance and components industry electronic components metal pin wetting resistance test before the aging accelerated life time test. Features : 1 Having safety device, including multi over-temperature protection and

Brand Name:ABB Module

Model Number:DDO01

Place of Origin:Sweden

ABB Module DDO01 ABB DDO01 TEST PLUG SOCKET superior quality produc Product Description: Features of the digital outputs:The 16 digital outputs are arranged in two groups of 8 outputs each. The two groups are electrically isolated from each other.The ...