it infrastructure thermal gap pad

Brand Name:ZIITEK

Model Number:TIF1160-30-02US

Place of Origin:China

3.0W Gray Easy Release Construction Silicone Pads for IT Infrastructure The TIF1160-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played ...

Brand Name:Ziitek

Model Number:TIF5120-18-11US thermal pad

Place of Origin:China

...thermal gap pad 1.8 W/MK 25shore00 For IT infrastructure Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal...

Brand Name:Ziitek

Model Number:TIF200-30-25S

Place of Origin:Vietnam

... gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Brand Name:Trumonytechs

Model Number:301-0300

Place of Origin:China

...Thermal Gap Pads Conductive Pad for Lithium Battery Electric Vehicle Discription of thermal conductive pad : The thermal conductive pad is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and thermal conductivity effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. thermal

Brand Name:Laird

Model Number:A18213-XX

Place of Origin:China

Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting

Brand Name:BERGQUIST

Model Number:GP3500ULM

Place of Origin:China

... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and

Brand Name:Adcol

Model Number:A-gapfill 220

Place of Origin:China

... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not

Brand Name:AOK

Model Number:TP500

Place of Origin:China

Green thermal rubber pad Thermal Conductive Pad With 5.0W/m.K For Power Supplies thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Dark green Visual Thickness(mm) 1.0~6.0 ...

Model Number:M-TP300

Place of Origin:China

...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap...

Brand Name:Race

Model Number:Silicone thermal pad

Place of Origin:Guangdong, China

...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal...

Brand Name:Hope-Wish

Model Number:HP-DMS10-2132

Place of Origin:China

Product Description: Long range 24-hours monitoring. Delicate and smooth images． Convenient for installation and application. 360 degree of Omni-directional Pan-Tilt Super-strong aluminum alloy with IP67 Higher sensitivity Effective in all environments ...

Brand Name:KKG

Model Number:802

Place of Origin:Dongguan

OEM/ODM Laptop Gpu Cpu Silica Gel Thermally Conductive Pad Thermal interface silicone material is high-performance, thermal conductive gap filling materials. Mainly for the transmission interface between the electronic equipment, and heat sink or product ...