low melting cpu thermal pad

Brand Name:Ziitek

Model Number:TIFT500-30-11US CPU Thermal Pad

Place of Origin:China

... to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11US Series thermally conductive interface materials are applied to

Brand Name:Ziitek

Model Number:TIC800G

Place of Origin:China

Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR...

Brand Name:Ziitek

Model Number:TIF200-20-02ES

Place of Origin:Vietnam

... Soft CPU Thermal Pad For Telecommunication Hardware Product descriptions TlFTM200-20-02ES is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress ...

Brand Name:AOK

Model Number:TP

Place of Origin:China

...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal

Brand Name:Race

Model Number:GTP010~GTP012

Place of Origin:China

Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40...

Place of Origin:china

Brand Name:Sail

Thermal Bonded Wadding Production Line Nonwoven Thermal Bonding Production Line Thermal bonded wadding production line processes polyester fibers and low melt fibers through opening, blending, carding, web forming, web bonding, and drying processes to ...

Place of Origin:Guangdong, China

Brand Name:OEM

Model Number:xiaowu

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Brand Name:BERGQUIST

Model Number:GP3500ULM

Place of Origin:China

... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and

Brand Name:Octopus

Model Number:4D×51MM

Place of Origin:China

...Low Melt Polyester Staple Fiber 4D×51mm For Padding White​ Definition: LMF or Low melt staple fiber is a fiber which is produced by using polyester and modified polyester to spin simultaneously. It has a lower melting point from 90 degrees to 220 degrees. 110℃ LMF is the most common in the market. When heated to 110-150 ℃, the sheath layer can melt and generate a sheath-core or side-by-side structure. Low melt...

Brand Name:TUNSING

Model Number:DS8606

Place of Origin:China

...e of thermoplastic polyurethane (TPU). TPU hot melt adhesive film possesses excellent thermal melting properties and adhesive characteristics, allowing it to quickly bond to various substrates when heated. The TPU hot melt adhesive film is commonly used in

Brand Name:Trumony

Place of Origin:Jiangsu，China

...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal...

Place of Origin:China

Brand Name:Rontex

...Low Melt Fiber 1. Product Introduction Low melting point polyester staple fiber is spun by ordinary polyester and modified polyester, which can melt and bond with other fibers at a lower temperature (110~200) than normal fiber. It has excellent bonding properties, and can be mixed with ordinary fiber to form non-woven fabric, and then heated and bonded together to become an elastic body. So its usage is very wide, such as the quilt, padding

Brand Name:yaoyang

Model Number:yaoyang

Place of Origin:China

Product Description: As a leading low melt fiber manufacturer, we take pride in producing top-quality products that meet the needs of our customers. Our low melt polyester fiber is designed to have a high tensile strength, ensuring that it can withstand...

Brand Name:Makeit

Model Number:4*51MM

Place of Origin:Jiangsu, China

...Low Melt Polyester Staple Fiber 1. Details Grade Virgin/Recyled Fineness 2D/4D Fiber Length 32/38/51MM Color Raw white Fiber Type Staple Pattern Siliconized/Non-siliconized Style Solid Weight 300kg/bale Frature Anti-Distortion,Anti-Static,Anti-Pilling,Abrasion-resistant. Flame restardant. Heat- resistant,Excellent thermal...

Model Number:M-TP300

Place of Origin:China

Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ...

Brand Name:XCWY

Model Number:S0006

Place of Origin:Hebei,China

Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ...

Brand Name:Adcol

Model Number:A-gapfill 600

Place of Origin:China

.... These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and

Brand Name:LF

Model Number:LF-ET0525

Place of Origin:Guangdong, Mainland China

Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ...

Brand Name:Laird

Model Number:A176XX-XX

Place of Origin:China

... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with