mems devices wafer bonder machine

Brand Name:ZMSH

Place of Origin:China

...Wafer Bonder​ The Wafer Bonder is a versatile solution for advanced semiconductor manufacturing, offering reliable direct bonding, anodic bonding, and thermocompression processes. Designed for high yield and repeatability, it supports 6- to 12-inch wafers with thickness flexibility, ensuring precise alignment and process stability for diverse applications like 3D IC packaging, MEMS devices...

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer 4'' 6'' 8'' for MEMS Devices Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics. The borosilicate glass wafers...

Brand Name:STARLAND

Model Number:XT-28

Place of Origin:China

... factory makes , ice cream wafer cone machine. ice cream wafer cone machine Competitive Points of ice cream wafer cone machine 1.High Productivity: Using Frequency conversion speed control. 2.Automation Device: Constant quantitative grouting, automatic ...

Model Number:TT25

Place of Origin:China

...Machine , Fully Automatic Wafer Making Machine TT25 series automatic baking machine is used for rolling sugar cones. It offers cones to the next process to be filled with ice cream. First it dispenses batter on the baking plates to prepare the wafers for shaping, and then rolls them up, keep them in shape unload them finally. It is the main device...

Brand Name:skyiwnbake

Model Number:two

Place of Origin:gungdong , China

... Description High Speed Wafer Biscuit Automatic Packing Line wafer automatic feeding and packing line including separation conveyor ,distribution conveyor , pushing device, storage conveyor and automatic packing machine.Products are aligned first,and the...

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers...

Brand Name:WZ

Model Number:WZ-GX01

Place of Origin:China

...Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer...

Brand Name:HOSON

Model Number:GTS80AH-I

Place of Origin:China

... operation and connection, improving production cycle time; ● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems; ● Utilizes a direct-drive motor to

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

...silicon wafers & thermal oxide silicon materials . Silicon wafer is the most common material and widely used for a varity of high-tech industries , including integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and

Brand Name:Jietai

Model Number:JTM-100504AD

Place of Origin:Dongguan, Guangdong

...achieve ultra-high surface purity of silicon wafers, critical for ensuring device yield and performance in IC fabrication and MEMS processing.​ Core Cleaning Stages:​ Ultrasonic Alkaline Cleaning: Utilizes cavitation effect at adjustable frequencies to

Brand Name:PAM-XIAMEN

Place of Origin:China

... wafers,thermal oxide silicon and epi wafers. Silicon wafer is used for integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells and finally apply to computer, mobile, sensor and other electronics. With

Brand Name:ZMSH

Model Number:3 Inch Quartz Wafer

Place of Origin:CHINA

...wafer ​ 3Inch Optical Grade Quartz Wafer Transmittance >92% Semiconductor Glass Substrates​​ ZMSH specializes in ​​custom-manufactured 3-inch quartz wafers​​, offering tailored solutions for advanced optoelectronic, MEMS, and semiconductor applications. Unlike standard 2-inch wafers, 3-inch quartz wafers provide expanded surface area for multi-component integration, enabling high-precision devices...

Brand Name:Crystro

Model Number:CR210816-03

Place of Origin:China

..., transducers and high frequency surface acoustic devices. Crystro's Fe:LiTaO3 is grown by Czochralski method.Max diameter reach 6inch,can offer kinds of size per required. Anhui ...

Brand Name:Mingseal

Model Number:GS600M

Place of Origin:China

MEMS Microphone Manufacturing Inline High-Precision Dispensing Solution For today’s cutting-edge MEMS sensors and ASIC chip manufacturing, ultra-precise fluid dispensing is critical to ensure performance and long-term device reliability. The GS600M Series Inline Visual Dispensing Machine, developed by Mingseal, is purpose-built to meet these tight requirements in MEMS...

Brand Name:Hiner-pack

Model Number:4" Wafer Shipping Cassette

Place of Origin:Made In China

... wafers is especially important in the manufacturing of integrated circuit chips due to the delicate nature of the chips. Then the wafer cassette is designed and mainly used to transport and store wafers during semiconductor manufacturing operations. It

Brand Name:Gerun

Model Number:2800

Place of Origin:CHINA

.... 2. Press correction After gluing and the second pressing to the bonder is smooth and firm. Equipped automatic correction device to make the carton size is correctly, and effectively avoid knife and fork phenomenone. Counting output devices and with the

Brand Name:Chuangwei

Model Number:CW-2A2P

Place of Origin:China

FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Working Picture: FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Simple introduction: This device is designed for double - deck working mode of double welding head. The equipment adopts ...

Brand Name:Chuangwei

Model Number:CW-2A2P

Place of Origin:China

FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Working Picture: FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Simple introduction: This device is designed for double - deck working mode of double welding head. The equipment adopts ...

Brand Name:JURONG

Model Number:CL-10800

Place of Origin:CHINA

...Wafers Ultrasonic Golf Club Cleaning Machine Model CL-10800 Voluem 960L Ultrasonic power 10.8kw Heating power 30kw Tank size 1500*800*800mm Overall size 1700*1280*1150mm Frequency 40/28KHz Weight 500kg Characteristics of ultrasonic cleaning machine 1. Equipped with automatic solution heating device, temperature control range: room temperature. 2, 2, equipped with ultrasonic cleaning timing device...

Categories:Laser Marking Machine

Country/Region:china

...glass wafer UV laser marking machine 3w 5w 8w 10w laser maeker for metal 1. The machine takes 355nm light laser device as the light source. Ultraviolet laser marking machines have the advantage of limiting thermal stress that other laser machines do not....