msap csp substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) ...

Brand Name:TYANSHINE

Model Number:TX-5266W250FC120-NUFENG-A01

Place of Origin:CN

... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency...

Brand Name:LEARNEW

Model Number:4055 SERIES

Place of Origin:China

72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ...

Brand Name:Dingang

Model Number:4.5mm×2000mm-1060

Place of Origin:China

...concentrated solar power (CSP) systems. These systems use mirrors to focus sunlight onto a receiver to generate heat for electricity production. The 1060 alloy, part of the 1xxx series with 99.6% aluminum, is ...

Brand Name:Lohua

Model Number:SL082011WF10030

Place of Origin:China

...CSP package can be cut off along the tangent line arbitrarily without damaging other parts. 2. Small in size and available in a variety of colors. 3. Regular size: 5m/coil. 4. Working Voltage: DC12V/24V, Working environment: －20℃～45℃. Product parameters: Item No. Model Specification of substrate(mm) CSP...

Brand Name:JUK

Model Number:KE2010-2060

Place of Origin:JAPAN

...m cnsmt Specification: JUK 2010 parameters Substrate size: 50×30 ~ 330×250mm Substrate thickness: 0.4 ~ 4mm Component size: 0402 ~ 20mm square components or 26.5 × 11mm IC / BGA / CSP Mounting speed: 11000CPH Mounting accuracy: 0.05MM / 0.03MM (for image ...

Brand Name:YAMAHA

Model Number:YAMAHA YG100R Machine

Place of Origin:Japan

..., QFP, connectors,PLCC, CSP/BGA, long ~ 0402-31 mm components, connectors (L100mm x W31mm) - >mind vision camera, 0603 - more than 31 type components, 45 mm long connector(L100mm x W45mm) - - more than 45 type vision camera Substrate size:

Brand Name:Phenson

Model Number:PS-C404

Place of Origin:Shenzhen,China

... LED, good heat dissipation, large current, high reliability. 4. Adopt 2.0mm thick and high thermal conductivity aluminum substrate to dissipate heat and

Model Number:800S

Place of Origin:shenzhen

... glue 2 Processing the maximum substrate size (MM) MAX 300(mm) 3 Applicable component type 0805, 0603, 0402. 0201, 01005 small components CSP, BGA, etc. single-sided / double-panel Dimensions 1 Dimensions L*W*H(MM) 4200*850*1450mm 2 Body weight 800KG...

Brand Name:XuanCai

Model Number:XC-36W 28*28/24 LED COB chip

Place of Origin:Guangdong, China

...CSP Chip 28*28/24 dimming light CRI>80 2700K-6000K for Hotel retail Product Information Product Item 28*28/24 Chip Material US Bridgelux Power 36W Current 1500MA Light Color white Luminous Intensity 110-120LM/W CRI >80 Color Temperature(K) 2700-6000k Product Description Using standard CRI index to design color points of light Using thermoelectric separation substrate...