wafer level chip scale package

Model Number:PCMF2HDMI2SZ

Product Overview Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two, and three differential channels. These devices are engineered to provide low insertion loss for high-speed ...

Brand Name:Hiner-pack

Model Number:3 Inch Series

Place of Origin:Made In China

...Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale

Brand Name:TI

Model Number:TPS63036YFGR

Place of Origin:original

TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA Product Status Active Function Step-Up/Step-Down Output Configuration Positive Topology Buck-Boost Output Type ...

Brand Name:Sme Electromechanical PLC Drive Cleaning Machine Purification System 8200 Specifications Sufficient Supply Delivery

Model Number:SME-8200

Place of Origin:china

Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic components. Measuring 8250*1970*1770mm (L*W*H), this ...

Model Number:MXC6255XC

Product Overview The MEMSIC MXC6255XC is a fully integrated, ultra-low-cost digital thermal orientation sensor with a chip-scale package. Utilizing patented MEMS-thermal technology and a standard 0.18um CMOS process, it offers robust orientation detection...

Brand Name:Mingseal

Model Number:GS600SW

Place of Origin:China

...Wafer-Level Underfill Dispenser is Mingseal’s flagship dispensing module designed for next-generation wafer-level packaging (WLP) and advanced redistribution layer (RDL) processes. Built to handle high-complexity underfill and flux spray operations, it is ideal for Fan-Out Wafer-Level Packaging...

Brand Name:SensorMicro

Place of Origin:Wuhan, Hubei Province, China

Model Number:Apex612W

...Wafer Level Packaging (WLP) detector series, delivering exceptional thermal imaging performance for demanding applications. Wafer Level Packaging (WLP) technology enables high vacuum packaging directly on the entire MEMS wafer, followed by scribing and cutting to produce ...

Brand Name:Truth Instruments

Model Number:Wafer-MOKE

Place of Origin:CHINA

Wafer-Level Hysteresis Loop Measurement Instrument Product Introduction Using polar/longitudinal magneto-optical Kerr effects (MOKE), this instrument rapidly and globally detects the magnetism of wafer films. Non-contact measurement avoids wafer damage and is suitable for post-patterning sample testing in spin chip...

Model Number:MXC4005XC

Brand Name:Original Factory

Place of Origin:CN

MXC4005 Sensor IC Monolithic And Wafer Level Packaged Three-Axis Accelerometer WLP-6 Product Overview Of MXC4005 The MXC4005 is a monolithic and wafer level packaged three-axis accelerometer featuring the smallest profile of 1.18mm×1.70mm×0.85mm, making...

Place of Origin:Shannxi，China

Brand Name:Hoan

Model Number:HACC-CUSTOM-GS

Custom MOS Capacitor Pinhole Free Glassivation Passivation Wafer Level S Parameter Consistency Fine Capacitance Step HACC-CUSTOM-GS: Pinhole-Free Glassivation MOS Capacitor with Wafer-Level S-Parameter Consistency & Fine Capacitance Step Advanced Pinhole-...

Brand Name:BeyondView

Model Number:FW312

Place of Origin:Beijing

... microbolometer structure has optimal sensitivity to long wavelengths between 8 and 14µm. FW312 infrared detector uses wafer-level packaging technology to minimize size and weight while ensuring stability and reliability, achieving a more compact and

Brand Name:JC

Model Number:ETCH-012

Place of Origin:China

A semiconductor quartz insert ring is a high-purity, precision-engineered ring made from fused quartz, crucial in semiconductor etching to guide etching gases, control plasma, and shield wafers from contamination, ensuring uniform etching, reduced defects...

Place of Origin:Henan, China

Brand Name:HDF

...Level Henna Powder Packaging Machine Guangzhou Product Description Model HDF-B302C Bag width 25-145mm Bag length 30-180mm Filling range 40-220ml Packing speed 20-60 bags/min Power 220v/2.2kw Size 650*1050*1950mm Weight 280kg The salt packaging machine adopts the world's most advanced microcomputer chip...

Brand Name:Gracias

Model Number:YH-320/420/520/620KT

Place of Origin:China

...Scale Packaging Machine Applications: Applicable to the automatic packaging of granular, flake,blockand other products with a diameter of not more than 6cm in thechemical, food, health care and pharmaceutical industries,such as: washing powder, plastic granules, sugar, salt, spiceseasoning, soybean,corn kernel, peanut , melon seeds, broadbeans, nuts, potato chips...

Brand Name:SunChon

Model Number:SUN-420

Place of Origin:China(Mainland), Guangdong

... (potato chips) Https://www.youtube.com/watch?v=AqiAZramjX4 4 heads weigher powder packing machine Trade Assurance Supplier Multi-Function Small Scale Packaging Machine For Popcorn / Sugar / Crisps /Peanut Features 1.All the packing process can ...

Brand Name:TEXAS INSTRUMENTS

Model Number:SN74AHC123AD

Place of Origin:original

SN74AHC123AD New And Original SOP16 Integrated Circuit ISO9001.pdf Product Technical Specifications EU RoHS Compliant ECCN (US) EAR99 Part Status Obsolete HTS 8542.39.00.01 SVHC Yes Automotive No PPAP No Logic Family AHC Logic Function Monostable ...

Brand Name:Haijing

Model Number:HJ-330 450

Place of Origin:RUIAN

Automatic V Bottom Paper Bag Making Machine Roll Fed High Speed Food Kraft Paper Bag Machinery Fully Automatic V-Bottom Paper Bag Machine High-Speed V-Bottom Paper Bag Machine Roll-Fed V-Bottom Paper Bag Machine V-Bottom Paper Bag Machine with Window V-B...

Categories:Panel Level Packaging Form

Country/Region:china

...Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and placed onto the temporary board. The compression molding is performed into the chips...

Brand Name:STARLAND

Model Number:XT-28

Place of Origin:Guangdong guangzhou

Large Scale Wafer Cone Making Machine with CE Features of Wafer Cone Making Machine Are you ready to take your wafer cone production to the next level? Look no further than our incredible Large Scale Wafer Cone Making Machine! With its high precision molds...

Brand Name:zmkj

Model Number:12inch 300mm single wafer container box

Place of Origin:CHINA

...Wafer Box Wafer Carrier Container Box Silicon Sapphire Box for 300mm semiconductor wafer shipping 2inch/3inch/4inch/6inch/8inch single wafer container box Waterproof 12 Inch Single Wafer Carrier Box Environmental Friendly Our company provides 1-inch, 2 inch, 2.5 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch single-chip silicon box, single-chip wafer box, single-chip silicon box, IC tray chip packaging...