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Aluminum Surface Mount Circuit Board Electronic PCB Board Thermal Conductivity RF Processing

Categories Telecom PCB Assembly
MOQ: 1
Price: Contact us
Payment Terms: T/T
Layer: 8L
Material: Aluminum
Copper Thickness: 1-3OZ
Min. Component Size: 01005
Min. Line Width/Spacing: 4/4 mil
Assembly Method: SMT/DIP
Item: ODM/OEM
Application: Base Atation RF Processing
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Aluminum Surface Mount Circuit Board Electronic PCB Board Thermal Conductivity RF Processing


Aluminum PCB Thermal Conductivity RF Processing PCBA Telecom PCB Assembly


What's Telecom PCB Assembly?


​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

  • ​​5G/4G base stations​​
  • ​​Fiber-optic networking devices​​
  • ​​Satellite communication systems​​
  • ​​Routers, switches, and modems​​
  • ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.


Features of Telecom PCBs:


1. High-Frequency Materials​​

    • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
    • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

    • ​​8+ layers​​ for complex routing.
    • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

    • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
    • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

    • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

      • ​​IPC-A-600, IPC-6012​​ (for reliability).
      • ​​RoHS, REACH​​ (for environmental safety).
      • ​​FCC, CE, ITU-T​​ (for telecom regulations).

Telecom PCB Assembly Process Characteristics

    • Components: high-frequency substrate (PTFE), high-temperature resistant chip (-40℃~125℃), 50Ω impedance matching.

    • Manufacturing accuracy: patch ±0.025mm (normal ±0.05mm), laser drilling + HDI high-density wiring.

    • Special processes: impedance control (differential line ±10%), electromagnetic shielding (metal cover), thermal management (aluminum substrate heat dissipation).


Technical Parameters


PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm

One-Stop PCBA Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production
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