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| Categories | Telecom PCB Assembly |
|---|---|
| MOQ: | 1 |
| Price: | Contact us |
| Payment Terms: | T/T |
| Layer: | 16L |
| Base Material: | FR-4 |
| Board Thickness: | 1.0mm |
| Min. Component Size: | 0201 |
| Min. hole size: | 0.1mm |
| Pin Space: | 0.2mm |
| PCB Assembly Method: | SMT/DIP |
| Application: | IoT Devices |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
Low Power Consumption High Integration Telecom PCB Assembly for IoT Devices
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
♦ Technical Parameters
PCB Assembly Capability | |||||
Item | Normal | Special | |||
SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm | |||
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