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6Inch Sic Silicon Carbide Substrate 4H-P Diameter 150mm Thickness 350μm Zero MPD Production, Standard Production Grade

Categories SiC Substrate
Brand Name: ZMSH
Model Number: 4H-P SiC
Certification: rohs
Place of Origin: CHINA
MOQ: 10pc
Price: by case
Payment Terms: T/T
Supply Ability: 1000pc/month
Delivery Time: in 30days
Packaging Details: customzied plastic box
Surface Hardness: HV0.3>2500
Density: 3.21 G/cm3
Thermal Expansion Coefficient: 4.5 X 10-6/K
Dielectric Constant: 9.7
Tensile Strength: >400MPa
Size: 6Inch
Breakdown Voltage: 5.5 MV/cm
Applications: Power Electronics, Lasers
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6Inch Sic Silicon Carbide Substrate 4H-P Diameter 150mm Thickness 350μm Zero MPD Production, Standard Production Grade

Product Description:

6Inch Sic Silicon Carbide Substrate 4H-P Diameter 150mm Thickness 350μm Zero MPD Production, Standard Production Grade

4H-P silicon carbide (SiC) is an important semiconductor material commonly used in high-temperature, high-frequency, and high-power electronic devices. 4H-SiC is a type of its crystal structure that has a hexagonal lattice structure. The wide bandgap (approx. 3.26 eV) allows it to operate in high temperature and high voltage environments. High thermal conductivity (about 4.9 W/m ·· K), superior to silicon, can effectively guide and dissipate heat. P-type doped silicon carbide has a low resistivity and is suitable for the construction of PN junctions. With the development of electric vehicles and renewable energy technologies, the demand for 4H-P type silicon carbide is expected to continue to grow, driving related research and technological advancements.



Features:

· Type: 4H-SiC crystal has a hexagonal lattice structure and provides excellent electrical characteristics.

· Wide bandgap: approx. 3.26 eV for high temperature and high frequency applications.

· P-type doping: P-type conductivity is obtained by doping elements such as aluminum, increasing the pore conductor concentration.

· Resistivity: Low resistivity, suitable for high power devices.

· High thermal conductivity: approx. 4.9 W/m·K, effective heat dissipation, suitable for high power density applications.

· High temperature resistance: It can work stably in high temperature environment.

· High hardness: Very high mechanical strength and toughness for harsh conditions.

· High breakdown voltage: Able to withstand higher voltages and reduce device size.

· Low switching loss: Good switching characteristics in high-frequency operation to improve efficiency.
· Corrosion resistance: Good corrosion resistance to a wide range of chemicals.

· Wide range of applications: suitable for electric vehicles, inverters, high-power amplifiers and other fields.



Technical Parameters:


6-inch diameter Silicon Carbide (SiC) Substrate Specification
GradeZero MPD Production
Grade (Z Grade)
Standard Production
Grade (P Grade)
Dummy Grade
(D Grade)
Diameter145.5 mm~150.0 mm
Thickness350 μm ± 25 μm
Wafer OrientationOff axis: 2.0°-4.0°toward [1120] ± 0.5° for 4H/6H-P, On axis:〈111〉± 0.5° for 3C-N
Micropipe Density0 cm-2
Resistivityp-type 4H/6H-P≤0.1 Ω.cm≤0.3 Ω.cm
Primary Flat Orientationp-type 4H/6H-P{1010} ± 5.0°
Primary Flat Length32.5 mm ± 2.0 mm
Secondary Flat Length18.0 mm ± 2.0 mm
Secondary Flat OrientationSilicon face up: 90° CW. from Prime flat ± 5.0°
Edge Exclusion3 mm6 mm
LTV/TTV/Bow /Warp≤2.5 μm/≤5 μm/≤15 μm/≤30 μm≤10 μm/≤15 μm/≤25 μm/≤40 μm
RoughnessPolish Ra≤1 nm
CMP Ra≤0.2 nmRa≤0.5 nm
Edge Cracks By High Intensity LightNoneCumulative length ≤ 10 mm, single length≤2 mm
Hex Plates By High Intensity LightCumulative area ≤0.05%Cumulative area ≤0.1%
Polytype Areas By High Intensity LightNoneCumulative area≤3%
Visual Carbon InclusionsCumulative area ≤0.05%Cumulative area ≤3%
Silicon Surface Scratches By High Intensity LightNoneCumulative length≤1×wafer diameter
Edge Chips High By Intensity LightNone permitted ≥0.2mm width and depth5 allowed, ≤1 mm each
Silicon Surface Contamination By High IntensityNone
PackagingMulti-wafer Cassette or Single Wafer Container


Applications:


1. Power electronics
Power converters: For efficient power adapters and inverters for smaller size and higher energy efficiency.
Electric vehicles: Optimize power conversion efficiency in drive modules and charging stations for electric vehicles.

2. RF devices
Microwave amplifiers: Used in communication and radar systems to provide reliable high-frequency performance.
Satellite Communications: High-power amplifier for communication satellites.

3. High temperature applications
Sensor: A sensor used in extreme temperature environments, capable of stable operation.
Industrial equipment: equipment and instruments adapted to high temperature conditions.

4. Optoelectronics
LED technology: Used to improve luminous efficiency in specific short-wavelength LEDs.
Lasers: Efficient laser applications.

5. Power system
Smart Grid: Improving energy efficiency and stability in high-voltage direct current (HVDC) transmission and grid management.

6. Consumer Electronics
Fast charging device: A portable charger for electronic devices that improves charging efficiency.

7. Renewable energy
Solar inverter: Achieve higher energy conversion efficiency in photovoltaic systems.



Customization:


Our SiC substrate is available in the 4H-P type and is RoHS certified. The minimum order quantity is 10pc and the price is by case. The packaging details are customized plastic boxes. The delivery time is within 30 days and we accept T/T payment terms. Our supply ability is 1000pc/month. The SiC substrate size is 6Inch. Place of origin is China.




FAQ:


1. Q: Do you offer custom service for 4H-P type SIC substrate?

A: Yes, our company provides custom service for 4H-P type silicon carbide substrate. Customers can choose substrates with different specifications and parameters, such as diameter, thickness, doping concentration, etc., according to their specific needs to meet the requirements of specific applications.


2. Q: How to ensure the quality of 4H-P type silicon carbide substrate?

A: Our company ensures the quality of 4H-P type silicon carbide substrate through strict process control and quality inspection. From raw material selection, crystal growth, cutting and polishing to final inspection, every step follows high standards and strict requirements to ensure that products meet customer expectations and industry standards.


Tag: #SIC, #Silicon carbide substrate, #4H crystal type, #P-type conductivity, #Semiconductor materials, #Sic 4H-P type.


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